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PMCT8316A1VRGFR

Texas Instruments

PMCT8316A1VRGFR by Texas Instruments

PMCT8316A1VRGFR by Texas Instruments is a Motion Control IC with 40 terminals, operating voltage range of 4.5V to 35V, and max output current of 8A. It is designed for Brushless DC Motor control applications, featuring a rectangular chip carrier package with very thin profile suitable for surface mount assembly at temperatures ranging from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,763 parts In-Stock

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Digiode

USA . 606 parts In-Stock

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Semicontronic

India . 1,357 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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1,357

$2.500

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$2.425

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One Stop Electronics

USA . 501 parts In-Stock

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$2.500

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$2.500

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 295 parts In-Stock

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$16.649

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295

$16.649

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Parana Technologies

USA . 357 parts In-Stock

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$18.796

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$18.884

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357

$18.796

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$18.884

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DigiPath Technology Company

USA . 251 parts In-Stock

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$20.697

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$19.041

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251

$20.697

$19.041

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IDEA Electronic Components Group

UK . 2,313 parts In-Stock

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$21.119

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$20.063

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$19.007

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$21.119

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ChromeModa Solutions

Germany . 349 parts In-Stock

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$21.119

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$17.318

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349

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Corphita

USA . 284 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the PMCT8316A1VRGFR by Texas Instruments, a leading manufacturer in Motion Control ICs. Designed to meet the demands of various applications, this chip carrier boasts a very thin profile and a maximum output current of 8A, making it ideal for brushless DC motor controllers. With a nominal supply voltage of 24V and a wide operating temperature range, this product offers unmatched value and performance to customers seeking top-notch motion control solutions.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount - YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Nominal Supply Voltage (Vsup) - 24 V

Optimal supply voltage of 24V ensures efficient and reliable operation of the motion control IC.

No. of Terminals - 40

Having 40 terminals allows for connection to multiple components and sensors, enabling precise control of motion.

Maximum Operating Temperature - 125 °C

High maximum operating temperature ensures stability and performance in demanding environments.

Minimum Operating Temperature - -40 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions without compromising functionality.

Maximum Output Current - 8 A

High maximum output current capability of 8A enables handling of high-power applications and motors.

Technical Specifications

Motion Control ICs PMCT8316A1VRGFR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

PMCT8316A1VRGFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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