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MC33033DWR2G

Onsemi

MC33033DWR2G by Onsemi

MC33033DWR2G by Onsemi is a Motion Control IC with 20V supply voltage, suitable for industrial applications. It features a max output current of 0.1A and operates in temperatures ranging from -40 to 85°C. This brushless DC motor controller has a small outline package style, making it ideal for compact designs.

Median Price

$5.430

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 432 parts In-Stock

1+ parts

$5.430

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$3.880

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$3.720

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432

$5.430

$3.880

$3.720

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Distributors (In-Stock)

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Nova Conductors

Japan . 49 parts In-Stock

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$5.057

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$5.057

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Digiode

USA . 598 parts In-Stock

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$5.158

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Chip Stock

USA . 6,500 parts In-Stock

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Vyrian

USA . 5,108 parts In-Stock

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Flip Electronics

USA . 812 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 280 parts In-Stock

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Holdelec - ElecDif-Pro

France . 75 parts In-Stock

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QIE Inc.

USA . 25 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 221 parts In-Stock

1+ parts

$4.620

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221

$4.620

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Corphita

USA . 1,210 parts In-Stock

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$4.887

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$4.887

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Corohmni

South Africa . 235 parts In-Stock

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$4.956

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235

$4.956

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Component Stockers USA

USA . 502 parts In-Stock

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$5.020

100+ parts

$3.580

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502

$5.020

$3.580

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Continental Prestige Electronics

USA . 882 parts In-Stock

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$5.057

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$4.956

882

$5.057

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$4.956

Netroflash

USA . 500 parts In-Stock

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$5.057

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500

$5.057

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AZTECH Wire

Italy . 604 parts In-Stock

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$17.233

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Perfect Parts

USA . 64,012 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 6,124 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,174 parts In-Stock

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Microchip USA

USA . 4,558 parts In-Stock

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Lixinc

USA . 3,949 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,644 parts In-Stock

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ChipstoGo Electronic ltd

UK . 3,000 parts In-Stock

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RC Electronics

USA . 3,000 parts In-Stock

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$5.390

1k+ parts

$5.080

10k+ parts

$4.980

3,000

-

$5.390

$5.080

$4.980

TANS Electronics

Latvia . 2,385 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,872 parts In-Stock

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Kulean Microsystems

USA . 1,711 parts In-Stock

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 651 parts In-Stock

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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Overview

Experience seamless motion control with the MC33033DWR2G by Onsemi, a leading manufacturer known for its top-notch quality. This motion control IC is perfect for a wide range of applications, offering precise and efficient control over brushless DC motors. With a compact design and industrial-grade temperature resistance, this IC ensures reliable performance even in harsh conditions. Enhance your projects with the value and benefits that the MC33033DWR2G brings, making it the ideal choice for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection for the IC, making it a reliable choice for long-term use.

Nominal Supply Voltage (Vsup): 20 V

The IC can operate efficiently at a standard supply voltage of 20V, making it compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand elevated temperatures without compromising performance.

Technology: BIPOLAR

The bipolar technology used in this IC provides reliable performance and precise control, making it suitable for motion control applications.

Peak Reflow Temperature °C: 260

The IC can withstand peak reflow temperatures of up to 260°C, ensuring stable operation during the manufacturing process.

Technical Specifications

Motion Control ICs MC33033DWR2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

22 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MC33033DWR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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