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MC33035DWR2G

Onsemi

MC33035DWR2G by Onsemi

MC33035DWR2G by Onsemi is a Brushless DC Motor Controller IC with 24 terminals. It operates b/w -40 to 85°C, with Vsup ranging from 10V to 30V. This small outline package is ideal for motion control applications requiring a max output current of 0.1A.

Median Price

$4.298

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 945 parts In-Stock

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$5.020

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$3.390

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Mouser Electronics

USA . 21,585 parts In-Stock

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$5.130

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$3.270

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$3.170

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$5.130

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DigiKey

USA . 9,489 parts In-Stock

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$5.220

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$3.330

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$3.182

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$5.220

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Element14

Singapore . 978 parts In-Stock

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$7.340

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$4.700

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978

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$4.320

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Farnell

UK . 978 parts In-Stock

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$2.630

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$2.470

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Master Electronics

USA . 624 parts In-Stock

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$3.040

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$2.750

624

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$2.750

Verical

USA . 620 parts In-Stock

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$3.576

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$3.424

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Rochester

USA . 396 parts In-Stock

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$2.600

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$2.330

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$2.190

396

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Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 2,881 parts In-Stock

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$1.980

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Digiode

USA . 820 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$3.090

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Maritex

Poland . 4,715 parts In-Stock

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$2.756

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Chip Stock

USA . 30,178 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,808 parts In-Stock

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Vyrian

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Flip Electronics

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Sensible Micro Corp

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NAC Semi

USA . 2,000 parts In-Stock

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$4.020

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$3.710

2,000

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$3.710

IBS Electronics

USA . 624 parts In-Stock

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$4.264

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$3.927

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$3.857

624

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$3.927

$3.857

Semtec, LLC

USA . 13 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Atlantic Semiconductor

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Distributors (Availability)

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Semicontronic

India . 8,452 parts In-Stock

1+ parts

$2.080

100+ parts

$2.028

1k+ parts

$2.018

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8,452

$2.080

$2.028

$2.018

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Ampacity Inc.

Singapore . 8,334 parts In-Stock

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$2.080

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Corphita

USA . 1,827 parts In-Stock

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$2.205

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Corohmni

South Africa . 363 parts In-Stock

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$2.450

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Continental Prestige Electronics

USA . 5,262 parts In-Stock

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$3.080

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Argo Parts USA

USA . 1,920 parts In-Stock

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Component Stockers USA

USA . 446 parts In-Stock

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$5.410

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$3.770

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Aztec Data Supply Inc.

USA . 1,452 parts In-Stock

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$20.338

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$20.338

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$24.366

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$23.147

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$23.147

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$24.366

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$23.147

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Modulus Dynamics

Lithuania . 5,216 parts In-Stock

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$24.481

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$24.481

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$24.481

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Perfect Parts

USA . 136,050 parts In-Stock

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Kepictronics

USA . 30,000 parts In-Stock

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RC Electronics

USA . 7,807 parts In-Stock

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$3.140

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$2.870

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$2.780

7,807

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$2.780

Kulean Microsystems

USA . 6,619 parts In-Stock

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Problanco Electronics

Mexico . 6,569 parts In-Stock

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SupplyDigital Components

Austria . 5,637 parts In-Stock

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TANS Electronics

Latvia . 5,012 parts In-Stock

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Robosynatics

Brazil . 3,841 parts In-Stock

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Lucentia Tech

USA . 3,841 parts In-Stock

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$24.304

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$23.808

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$23.808

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$23.808

GreenTree Electronics

Israel . 3,815 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,040 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 1,202 parts In-Stock

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Lixinc

USA . 599 parts In-Stock

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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Overview

Enhance your motion control applications with the MC33035DWR2G by Onsemi. With a reputation for quality and reliability, Onsemi's Motion Control ICs are designed to deliver precise control and efficiency. The MC33035DWR2G offers customers unparalleled value with its versatile applications in brushless DC motor control. Experience the benefits of seamless integration, high performance, and ease of use in a compact package. Upgrade your projects with Onsemi's trusted technology and unlock a world of possibilities in motion control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding extra weight or compromising on reliability.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 20 V

Optimal voltage level for efficient performance of the motion control IC.

No. of Terminals: 24

Sufficient number of terminals for connecting the IC to other components in the circuit.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation in challenging environments.

Technology: BIPOLAR

Bipolar technology offers better precision and control compared to other technologies, making the IC a good choice for precise motion control applications.

Technical Specifications

Motion Control ICs MC33035DWR2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

15.395 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MC33035DWR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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