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MC33035P

Onsemi

MC33035P by Onsemi

MC33035P by Onsemi is a 24-terminal motion control IC with a supply voltage range of 10-30V. It operates b/w -40 to 85°C, suitable for industrial applications. This bipolar technology brushless DC motor controller has a max output current of 0.01A and peak reflow temperature of 235°C.

Median Price

$4.900

Lifecycle Status

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17

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Forefront Electronics and Design

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Sunrise Surplus Inc.

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Ampacity Inc.

Singapore . 1,196 parts In-Stock

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Corohmni

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Semicontronic

India . 1,397 parts In-Stock

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AZTECH Wire

Italy . 772 parts In-Stock

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Aztec Data Supply Inc.

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SupplyDigital Components

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Overview

Elevate your motion control systems with the MC33035P by Onsemi. Crafted with precision and expertise, this Brushless DC Motor Controller boasts top-tier quality and reliability that Onsemi is renowned for. Whether you're working on robotics, automotive applications, or industrial machinery, this IC delivers unparalleled performance and efficiency. With a wide supply voltage range, compact design, and advanced technology, the MC33035P offers unmatched value and benefits to streamline your projects and elevate your end products. Experience the difference with Onsemi's MC33035P today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, ensuring the product can withstand rough handling and environmental conditions.

Nominal Supply Voltage (Vsup): 20 V

Operating at a nominal supply voltage of 20V allows for stable and efficient performance of the motion control IC.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this motion control IC can function effectively in industrial environments with high temperature conditions.

Technology: BIPOLAR

Utilizing bipolar technology offers precise control and power efficiency, making this motion control IC a reliable choice for various applications.

Maximum Output Current: 0.01 A

The maximum output current of 0.01A ensures that the motion control IC can effectively drive and control various types of motors without causing overheating or damage.

Technical Specifications

Motion Control ICs MC33035P attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Length:

31.69 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.4 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33035P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-474-5276, 5962144745276

NIIN

144745276

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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