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MC33035PG

Onsemi

MC33035PG by Onsemi

MC33035PG by Onsemi is a 24-terminal motion control IC with a supply voltage range of 10-30V. It operates in industrial temperatures (-40 to 85°C) and controls brushless DC motors with a max output current of 0.1A. The rectangular plastic/epoxy package has dimensions of 31.69mm x 7.62mm x 4.44mm, making it suitable for various motor control applications.

Median Price

$2.408

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.408

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500

$2.408

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Chip Stock

USA . 40,000 parts In-Stock

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40,000

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Vyrian

USA . 6,237 parts In-Stock

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6,237

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Digiode

USA . 1,845 parts In-Stock

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1,845

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LIBRA Elektronik GmbH

Germany . 15 parts In-Stock

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15

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,264 parts In-Stock

1+ parts

$0.500

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1,264

$0.500

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Semicontronic

India . 742 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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742

$1.500

$1.462

$1.455

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Corohmni

South Africa . 422 parts In-Stock

1+ parts

$2.360

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422

$2.360

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Continental Prestige Electronics

USA . 4,950 parts In-Stock

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$2.408

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$2.360

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$2.408

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$2.360

Argo Parts USA

USA . 4,115 parts In-Stock

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$2.408

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.408

100+ parts

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$2.288

10k+ parts

$2.239

500

$2.408

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$2.288

$2.239

AZTECH Wire

Italy . 787 parts In-Stock

1+ parts

$10.214

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787

$10.214

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Modulus Dynamics

Lithuania . 4,524 parts In-Stock

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$14.034

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$14.034

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$14.034

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4,524

$14.034

$14.034

$14.034

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Aztec Data Supply Inc.

USA . 917 parts In-Stock

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$20.415

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917

$20.415

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$20.784

100+ parts

$19.745

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$19.745

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5,000

$20.784

$19.745

$19.745

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Kepictronics

USA . 30,000 parts In-Stock

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Lixinc

USA . 12,063 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,196 parts In-Stock

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Kulean Microsystems

USA . 5,332 parts In-Stock

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Microchip USA

USA . 4,889 parts In-Stock

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SupplyDigital Components

Austria . 1,294 parts In-Stock

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Problanco Electronics

Mexico . 1,166 parts In-Stock

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TANS Electronics

Latvia . 920 parts In-Stock

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Corphita

USA . 498 parts In-Stock

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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126

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Overview

Experience superior motion control with the MC33035PG by Onsemi, a leading manufacturer of high-quality Motion Control ICs. Designed for precise and efficient operation, this brushless DC motor controller offers unmatched reliability and performance in a compact, rectangular package. Ideal for industrial applications, this innovative IC provides customers with the value, benefits, and advantages they need to stay ahead of the competition.Upgrade your motion control systems today with the MC33035PG and experience the difference that Onsemi quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the IC, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 20 V

Optimal voltage for efficient and stable operation of the IC.

No. of Terminals: 24

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, increasing versatility.

Technology: BIPOLAR

Bipolar technology offers precise control and efficient performance.

Technical Specifications

Motion Control ICs MC33035PG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.69 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33035PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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