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DRV8316TRGFR

Texas Instruments

DRV8316TRGFR by Texas Instruments

DRV8316TRGFR by Texas Instruments is a Motion Control IC with 40 terminals, operating voltage range of 4.5V to 35V, and max output current of 8A. Ideal for automotive applications due to its high temp grade and compact size (7mm x 5mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,971 parts In-Stock

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Digiode

USA . 2,711 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,174 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 1,092 parts In-Stock

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$3.500

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$3.412

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$3.395

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$3.395

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One Stop Electronics

USA . 1,337 parts In-Stock

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$5.500

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Parana Technologies

USA . 140 parts In-Stock

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$10.501

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$11.013

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140

$10.501

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$11.013

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DigiPath Technology Company

USA . 596 parts In-Stock

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$11.563

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$10.638

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596

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$10.638

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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$11.799

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$11.209

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$10.619

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$10.619

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ChromeModa Solutions

Germany . 1,351 parts In-Stock

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$11.799

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$9.675

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AZTECH Wire

Italy . 342 parts In-Stock

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$17.459

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Corohmni

South Africa . 398 parts In-Stock

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$17.773

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Corphita

USA . 4,124 parts In-Stock

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Microchip USA

USA . 2,315 parts In-Stock

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Continental Prestige Electronics

USA . 2,158 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 873 parts In-Stock

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873

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Overview

Experience superior motion control performance with the DRV8316TRGFR by Texas Instruments. Crafted with precision and expertise, this motion control IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product guarantees smooth and efficient operation. From automotive to industrial use, the DRV8316TRGFR delivers value like no other, providing customers with enhanced functionality and ease of use. Trust Texas Instruments to bring innovation to your projects with the DRV8316TRGFR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 24 V

Provides enough power to efficiently control motion and operations.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

Enables the product to function in cold conditions without any issues, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance, ensuring stable connections for enhanced performance.

Width (mm): 5 mm

Compact size allows for easy integration into different systems without taking up much space.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for flexibility in power supply options, making it suitable for various applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in automotive applications.

Maximum Output Current: 8 A

Capable of handling high current outputs, suitable for driving motors and controlling motion efficiently.

Technical Specifications

Motion Control ICs DRV8316TRGFR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.19X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

21 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

DRV8316TRGFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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