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DRV8711DCP

Texas Instruments

DRV8711DCP by Texas Instruments

DRV8711DCP by Texas Instruments is a motion control IC with a nominal voltage of 24V. It is a stepper motor controller with a max operating temperature of 85°C, making it suitable for industrial applications. Its compact size and surface mount capability make it easy to integrate into various systems.

Median Price

$5.140

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 37,416 parts In-Stock

1+ parts

$4.636

100+ parts

$4.062

1k+ parts

$2.295

10k+ parts

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37,416

$4.636

$4.062

$2.295

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Mouser Electronics

USA . 7,321 parts In-Stock

1+ parts

$6.190

100+ parts

$3.930

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-

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7,321

$6.190

$3.930

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Farnell

UK . 231 parts In-Stock

1+ parts

$6.490

100+ parts

$3.640

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-

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231

$6.490

$3.640

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Arrow

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.674

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-

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50

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$3.674

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RS (Exports)

UK . 10 parts In-Stock

1+ parts

-

100+ parts

$5.140

1k+ parts

$4.626

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10

-

$5.140

$4.626

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.467

100+ parts

-

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150

$3.467

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Digiode

USA . 673 parts In-Stock

1+ parts

$4.404

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673

$4.404

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Chip Stock

USA . 41,660 parts In-Stock

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41,660

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Vyrian

USA . 6,487 parts In-Stock

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Bristol Electronics

USA . 1,050 parts In-Stock

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Semicontronic

India . 5,594 parts In-Stock

1+ parts

$3.120

100+ parts

$3.042

1k+ parts

$3.026

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5,594

$3.120

$3.042

$3.026

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Argo Parts USA

USA . 1,161 parts In-Stock

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$3.467

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$3.467

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Corphita

USA . 2,600 parts In-Stock

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$4.172

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2,600

$4.172

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Parana Technologies

USA . 764 parts In-Stock

1+ parts

$4.495

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$4.936

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764

$4.495

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$4.936

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DigiPath Technology Company

USA . 1,399 parts In-Stock

1+ parts

$4.950

100+ parts

$4.554

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1,399

$4.950

$4.554

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$5.051

100+ parts

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$4.546

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2,182

$5.051

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$4.546

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ChromeModa Solutions

Germany . 1,378 parts In-Stock

1+ parts

$5.051

100+ parts

$4.142

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1,378

$5.051

$4.142

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Continental Prestige Electronics

USA . 735 parts In-Stock

1+ parts

$5.580

100+ parts

$4.550

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735

$5.580

$4.550

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Corohmni

South Africa . 582 parts In-Stock

1+ parts

$6.053

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582

$6.053

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Ampacity Inc.

Singapore . 5,566 parts In-Stock

1+ parts

$6.800

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5,566

$6.800

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$8.028

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$7.626

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$7.626

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$8.028

$7.626

$7.626

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Lixinc

USA . 17,299 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,549 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,699 parts In-Stock

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iBuyXS LLC

. 1,050 parts In-Stock

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Computer Components Inc. - USA

USA . 1,050 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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$0.033

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$0.033

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$0.033

950

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$0.033

$0.033

$0.033

Lucentia Tech

USA . 950 parts In-Stock

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$0.033

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$0.033

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$0.033

950

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$0.033

$0.033

$0.033

Modulus Dynamics

Lithuania . 99 parts In-Stock

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Overview

Experience seamless motion control with the DRV8711DCP by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. The DRV8711DCP falls under the category of Motion Control ICs, offering a wide range of applications for various industries. With its compact rectangular shape and small outline, this product is easy to integrate into any design. Boasting a nominal supply voltage of 24V and a maximum supply current of 20mA, the DRV8711DCP provides optimal performance. Whether you're working with stepper motor controllers or other motion control systems, this product exceeds expectations. Unlock the power of precise and efficient motion control with the DRV8711DCP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product has a package body made of plastic/epoxy, providing durability and resistance to external factors, making it a reliable choice for motion control applications.

Surface Mount: YES

With surface mount capability, this IC offers easy installation and integration onto circuit boards, saving valuable space and allowing for efficient use of PCB real estate.

No. of Functions: 1

This IC is designed to perform a single function, ensuring simplicity and ease of use in motion control applications.

Package Shape: RECTANGULAR

The rectangular package shape of this IC facilitates straightforward installation and helps optimize layout on the PCB, enhancing overall system design and functionality.

Nominal Supply Voltage (Vsup): 24 V

With a nominal supply voltage of 24 V, this IC is compatible with a wide range of motion control systems, providing flexibility and compatibility for various applications.

No. of Terminals: 38

The high number of terminals on this IC enables seamless connectivity and integration with external components, enhancing system versatility and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline package style combined with heat sink/slug, thin profile, and shrink pitch design ensures efficient heat dissipation and compactness, making it an ideal choice for space-constrained motion control systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand harsh operating conditions without compromising performance, making it suitable for demanding industrial applications.

Minimum Operating Temperature: -40 °C

This IC has a minimum operating temperature of -40°C, allowing it to function reliably even in extremely cold environments, expanding its suitability across a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures superior conductivity, corrosion resistance, and long-term reliability, making this IC an excellent choice for motion control applications requiring precision and durability.

Terminal Position: DUAL

The dual terminal position enables easy and secure connections, ensuring robust connectivity and minimizing the risk of disconnection or signal loss, making it a dependable option for motion control systems.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this IC offers a compact form factor, facilitating space-saving designs and enabling highly integrated motion control solutions.

Width (mm): 4.4 mm

With a width of just 4.4 mm, this IC's small footprint allows for efficient use of PCB space, enabling compact motion control system designs.

Other IC type: STEPPER MOTOR CONTROLLER

This IC's specific type as a stepper motor controller caters to precise motion control requirements, offering accurate positioning, smooth operation, and excellent control over stepper motor systems.

Minimum Supply Voltage (Vsup): 8 V

With a minimum supply voltage of 8 V, this IC can operate efficiently with low power input, making it suitable for applications with restricted power availability or energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand a maximum time of 30 seconds at the peak reflow temperature, ensuring reliable soldering during manufacturing processes, contributing to the overall quality and reliability of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can endure and maintain optimal performance during surface mount assembly processes, ensuring smooth production and quality control.

Length: 9.7 mm

Measuring only 9.7 mm in length, this IC offers a compact size, facilitating space-efficient designs and allowing it to be easily integrated into motion control systems with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this IC ensures its reliability and functionality across a wide temperature range, making it suitable for demanding industrial applications.

Maximum Supply Current (Isup): 20 mA

With a maximum supply current of 20 mA, this IC operates with low power consumption, contributing to energy efficiency and extending the lifespan of battery-powered motion control systems.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable soldering connections, minimizing the risk of solder joint failure and improving overall system reliability, making it an excellent choice for motion control applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this IC supports high-density PCB designs, enabling compact and space-efficient motion control system layouts.

Moisture Sensitivity Level (MSL): 2

This IC has a moisture sensitivity level of 2, indicating its resistance to moisture absorption, ensuring its reliability and performance integrity during storage and handling.

Maximum Supply Voltage (Vsup): 52 V

With a maximum supply voltage of 52 V, this IC can accommodate motion control systems operating at higher voltage levels, providing flexibility and versatility in system design.

Technical Specifications

Motion Control ICs DRV8711DCP attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

52 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

DRV8711DCP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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