Loading...

LV8413GP-TE-L-H

Onsemi

LV8413GP-TE-L-H by Onsemi

LV8413GP-TE-L-H by Onsemi is a Motion Control IC in PLASTIC/EPOXY package with 16 terminals. Operates at -20 to 85°C, with 3.3/5V supplies and BICMOS technology. Ideal for motion control applications requiring low supply current and high peak reflow temperatures.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$17.810

100+ parts

$16.207

1k+ parts

$14.604

10k+ parts

-

500

$17.810

$16.207

$14.604

-

Verical

USA . 105,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

105,139

-

-

$1.413

$1.262

Rochester

USA . 1,688 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

1,688

-

$1.420

$1.180

$1.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 862 parts In-Stock

1+ parts

$1.112

100+ parts

-

1k+ parts

-

10k+ parts

-

862

$1.112

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.876

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$1.876

-

-

-

TEDSS.com

USA . 100 parts In-Stock

1+ parts

$2.000

100+ parts

$0.990

1k+ parts

-

10k+ parts

-

100

$2.000

$0.990

-

-

Bristol Electronics

USA . 638 parts In-Stock

1+ parts

$2.100

100+ parts

$1.302

1k+ parts

$0.787

10k+ parts

-

638

$2.100

$1.302

$0.787

-

Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Chip Stock

USA . 4,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,170

-

-

-

-

Vyrian

USA . 2,267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

638

-

-

-

-

Dan-Mar Components

USA . 638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

638

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 58,020 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

10k+ parts

-

58,020

$0.990

-

-

-

Semicontronic

India . 57,914 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

-

57,914

$0.990

$0.965

$0.960

-

Corphita

USA . 360 parts In-Stock

1+ parts

$1.053

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$1.053

-

-

-

Corohmni

South Africa . 397 parts In-Stock

1+ parts

$1.170

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$1.170

-

-

-

Continental Prestige Electronics

USA . 5,481 parts In-Stock

1+ parts

$1.876

100+ parts

-

1k+ parts

-

10k+ parts

$1.838

5,481

$1.876

-

-

$1.838

Argo Parts USA

USA . 1,276 parts In-Stock

1+ parts

$1.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,276

$1.876

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.876

100+ parts

-

1k+ parts

$1.782

10k+ parts

$1.745

1,000

$1.876

-

$1.782

$1.745

AZTECH Wire

Italy . 905 parts In-Stock

1+ parts

$12.320

100+ parts

-

1k+ parts

-

10k+ parts

-

905

$12.320

-

-

-

Aztec Data Supply Inc.

USA . 272 parts In-Stock

1+ parts

$15.277

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$15.277

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$17.810

100+ parts

$16.207

1k+ parts

$14.604

10k+ parts

-

500

$17.810

$16.207

$14.604

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,555

-

-

-

-

Perfect Parts

USA . 8,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,420

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,196

-

-

-

-

Kulean Microsystems

USA . 7,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,039

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

SupplyDigital Components

Austria . 5,381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,381

-

-

-

-

Alle Elektronik GmbH

Germany . 4,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,797

-

-

-

-

Problanco Electronics

Mexico . 3,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,969

-

-

-

-

Microchip USA

USA . 3,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,741

-

-

-

-

Metaverse IC Inc.

Canada . 2,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,366

-

-

-

-

UHIMA Technologies

Türkiye . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

310

-

-

-

-

TANS Electronics

Latvia . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

247

-

-

-

-

Kepictronics

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Overview

Upgrade your motion control systems with the LV8413GP-TE-L-H by Onsemi. Known for their superior quality and reliability, Onsemi brings you a cutting-edge solution in the form of this motion control IC. Ideal for a wide range of applications, this product offers unmatched performance and efficiency, making it a valuable asset for customers looking to optimize their systems. Experience the seamless integration, precise control, and enhanced functionality that the LV8413GP-TE-L-H has to offer. Trust Onsemi to deliver excellence in motion control ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, reducing the risk of damage during assembly and operation.

Package Shape: SQUARE

Optimal shape for space-efficient placement on circuit boards, allowing for more compact and efficient designs.

Power Supplies (V): 3.3,5

Supports a wide range of power supply voltages, making it versatile and compatible with various systems.

No. of Terminals: 16

Provides a sufficient number of connections for interfacing with other components, allowing for flexible integration into different designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and efficient signal routing, enhancing overall product reliability and performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in a wide range of environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures the IC can function in colder environments without risk of damage or malfunction.

Terminal Position: QUAD

Quad terminal position provides better connectivity and signal integrity, improving overall performance of the IC.

Maximum Supply Current (Isup): 1.2 mA

Low supply current consumption enhances energy efficiency and prolongs battery life in portable devices.

Technology: BICMOS

BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed and low-power performance for the IC.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joints cracking or breaking, ensuring reliable connections in various applications.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high density mounting of the IC, saving space on the circuit board and enabling compact designs.

Technical Specifications

Motion Control ICs LV8413GP-TE-L-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8413GP-TE-L-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20