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LV8411GR

Onsemi

LV8411GR by Onsemi

LV8411GR by Onsemi is a Motion Control IC with 24 terminals, suitable for BRUSH DC MOTOR CONTROL. It operates b/w -40 to 85 °C and supports Vsup from 2.5V to 5.5V, with a max output current of 0.6A.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,891 parts In-Stock

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Digiode

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SPM Sales

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SupplyDigital Components

Austria . 6,635 parts In-Stock

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Kulean Microsystems

USA . 5,472 parts In-Stock

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Problanco Electronics

Mexico . 2,229 parts In-Stock

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Corphita

USA . 1,265 parts In-Stock

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UHIMA Technologies

Türkiye . 519 parts In-Stock

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Corohmni

South Africa . 286 parts In-Stock

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TANS Electronics

Latvia . 178 parts In-Stock

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Overview

Discover the LV8411GR by Onsemi, a high-quality Motion Control IC designed to deliver exceptional performance and reliability. With a focus on innovation and cutting-edge technology, Onsemi ensures that their products meet the highest industry standards. Ideal for applications in brush DC motor control, this compact and versatile chip carrier boasts a wide range of benefits, including a nominal supply voltage of 3.3V, low power consumption, and an industrial temperature grade. Experience seamless motion control with the LV8411GR and unlock new possibilities for your projects. Upgrade your systems today with Onsemi's superior expertise and advanced solutions.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB mounting, saving space and simplifying the production process.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a common supply voltage, making it easier to integrate into various systems and designs.

Power Supplies (V): 3.3,5

Support for multiple power supply options provides flexibility in powering the device based on the application requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications where heat resistance is necessary.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable performance in extreme cold environments, enhancing the product's durability.

Minimum Supply Voltage (Vsup): 2.5 V

With a low minimum supply voltage, this IC can operate efficiently even with limited power sources.

Maximum Output Current: 0.6 A

Capable of delivering up to 0.6 A output current, making it suitable for driving brush DC motors with varying power requirements.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance between the speed of bipolar transistors and the low power of CMOS, enhancing the performance of the IC.

Technical Specifications

Motion Control ICs LV8411GR attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N24

Length:

3 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.13SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

LV8411GR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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