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LV8402GP-TE-L-H

Onsemi

LV8402GP-TE-L-H by Onsemi

LV8402GP-TE-L-H by Onsemi is a Motion Control IC with 24 terminals, operating voltage range of 2.8V to 5.5V, and max output current of 2.5A. Ideal for BRUSH DC MOTOR CONTROL applications due to its BICMOS technology and compact CHIP CARRIER package style at -30 °C to 85°C temperature range.

Median Price

$1.512

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 122,777 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.210

10k+ parts

$1.080

122,777

-

$1.460

$1.210

$1.080

Verical

USA . 96,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.512

10k+ parts

$1.350

96,280

-

-

$1.512

$1.350

Flip Electronics (Authorized)

USA . 58,000 parts In-Stock

1+ parts

-

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58,000

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-

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DigiKey

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

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1,890

-

-

$1.830

-

Distributors (In-Stock)

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Vyrian

USA . 2,117 parts In-Stock

1+ parts

$1.020

100+ parts

-

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2,117

$1.020

-

-

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Digiode

USA . 1,911 parts In-Stock

1+ parts

$1.140

100+ parts

-

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1,911

$1.140

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TEDSS.com

USA . 94 parts In-Stock

1+ parts

$1.520

100+ parts

$1.290

1k+ parts

-

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94

$1.520

$1.290

-

-

Flip Electronics

USA . 62,000 parts In-Stock

1+ parts

-

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62,000

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DigiKey Marketplace

USA . 1,890 parts In-Stock

1+ parts

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100+ parts

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1,890

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-

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Distributors (Availability)

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$1.020

100+ parts

-

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371

$1.020

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Corphita

USA . 963 parts In-Stock

1+ parts

$1.080

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963

$1.080

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Kepictronics

USA . 72,000 parts In-Stock

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72,000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 13,785 parts In-Stock

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13,785

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TANS Electronics

Latvia . 8,004 parts In-Stock

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8,004

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SupplyDigital Components

Austria . 6,122 parts In-Stock

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6,122

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Problanco Electronics

Mexico . 4,225 parts In-Stock

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4,225

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A-Z Elektronik GmbH

Germany . 2,127 parts In-Stock

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Assy Fe

Spain . 1,997 parts In-Stock

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1,997

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Continental Prestige Electronics

USA . 1,890 parts In-Stock

1+ parts

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1k+ parts

$1.020

10k+ parts

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1,890

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$1.020

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Alle Elektronik GmbH

Germany . 1,418 parts In-Stock

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1,418

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Microchip USA

USA . 432 parts In-Stock

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432

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UHIMA Technologies

Türkiye . 78 parts In-Stock

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78

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Kulean Microsystems

USA . 31 parts In-Stock

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31

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Overview

Enhance your motion control applications with the LV8402GP-TE-L-H by Onsemi, a top-quality brush DC motor controller designed to optimize performance and efficiency. With a compact square chip carrier package and a wide supply voltage range, this IC offers versatile solutions for various industries. Trust in Onsemi's expertise in motion control ICs to deliver reliable and innovative products that elevate your projects. Discover the exceptional value and benefits of the LV8402GP-TE-L-H today and experience seamless operation like never before.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to integrate into surface mount PCB designs, reducing assembly time and cost.

Nominal Supply Voltage (Vsup): 3 V

Provides a stable voltage supply for the motion control IC, ensuring reliable performance.

No. of Terminals: 24

Offers plenty of connection options for interfacing with external components in a motion control system.

Maximum Operating Temperature: 85 °C

Can operate efficiently in a wide range of temperature conditions, making it suitable for various environments.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and thin profile design saves space on the PCB, ideal for applications with size constraints.

Maximum Output Current: 2.5 A

Capable of driving higher current loads, making it suitable for controlling motors with higher power requirements.

Technical Specifications

Motion Control ICs LV8402GP-TE-L-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 1.5V TO 15V SUPPLY

Other IC type:

JESD-30 Code:

S-XQCC-N24

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

2.5 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

LV8402GP-TE-L-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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