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LV8405V

Onsemi

LV8405V by Onsemi

LV8405V by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 2.8-5.5 V, and output current up to 2.5 A. Ideal for brush DC motor control applications due to its BICMOS technology and compact rectangular package design with small outline and low profile features.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,429 parts In-Stock

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2,429

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Vyrian

USA . 1,610 parts In-Stock

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1,610

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,550 parts In-Stock

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7,550

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SupplyDigital Components

Austria . 6,069 parts In-Stock

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6,069

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Kulean Microsystems

USA . 4,497 parts In-Stock

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4,497

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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UHIMA Technologies

Türkiye . 691 parts In-Stock

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691

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TANS Electronics

Latvia . 520 parts In-Stock

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520

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Corphita

USA . 290 parts In-Stock

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290

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Corohmni

South Africa . 222 parts In-Stock

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222

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Overview

Unleash the power of precision with the LV8405V Motion Control IC by Onsemi. Crafted with high-quality materials and cutting-edge technology, this product offers unrivaled performance and reliability. From robotics to automotive applications, this versatile IC caters to a wide range of industries with ease. Elevate your projects with the LV8405V - experience seamless control, efficiency, and innovation like never before. Step into the future of motion control with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and ensures protection for the internal components of the motion control IC, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard voltage level, making it compatible with a wide range of applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact design with a low profile allows for space-efficient integration into devices, while the shrink pitch enhances overall PCB density.

Maximum Operating Temperature: 85 °C

Ability to withstand high temperature environments, ensuring reliable performance in demanding conditions.

Maximum Output Current: 2.5 A

Capable of delivering high output current, making it suitable for driving various types of motors with different power requirements.

Technical Specifications

Motion Control ICs LV8405V attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 1.5 TO 15V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3,6

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LV8405V Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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