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LV8413GP-H

Onsemi

LV8413GP-H by Onsemi

LV8413GP-H by Onsemi is a Motion Control IC in a square chip carrier package. Operates at -30 to 85°C with power supplies of 3.3V and 5V. Features BICMOS technology, suitable for applications requiring precise motion control in compact designs.

Median Price

$1.413

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,154 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

3,154

-

$1.360

$1.130

$1.010

DigiKey

USA . 3,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.700

10k+ parts

-

3,154

-

-

$1.700

-

Verical

USA . 2,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

2,530

-

-

$1.413

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$1.060

-

-

-

Digiode

USA . 402 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$1.064

-

-

-

Chip Stock

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,000

-

-

-

-

Vyrian

USA . 2,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,721

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,892 parts In-Stock

1+ parts

$0.840

100+ parts

$0.819

1k+ parts

$0.815

10k+ parts

-

2,892

$0.840

$0.819

$0.815

-

Ampacity Inc.

Singapore . 2,715 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

2,715

$0.840

-

-

-

Corohmni

South Africa . 376 parts In-Stock

1+ parts

$0.984

100+ parts

-

1k+ parts

-

10k+ parts

-

376

$0.984

-

-

-

Corphita

USA . 1,344 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,344

$1.008

-

-

-

Argo Parts USA

USA . 1,209 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,209

$1.060

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$1.060

100+ parts

$1.007

1k+ parts

$0.957

10k+ parts

$0.943

100

$1.060

$1.007

$0.957

$0.943

Aztec Data Supply Inc.

USA . 3,554 parts In-Stock

1+ parts

$4.700

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

$4.700

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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26,264

-

-

-

-

SupplyDigital Components

Austria . 7,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,796

-

-

-

-

Kulean Microsystems

USA . 7,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,083

-

-

-

-

Problanco Electronics

Mexico . 6,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,787

-

-

-

-

Microchip USA

USA . 5,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,662

-

-

-

-

Continental Prestige Electronics

USA . 3,154 parts In-Stock

1+ parts

-

100+ parts

$0.953

1k+ parts

-

10k+ parts

-

3,154

-

$0.953

-

-

TANS Electronics

Latvia . 2,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,702

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

283

-

-

-

-

UHIMA Technologies

Türkiye . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

208

-

-

-

-

Overview

Experience next-level motion control with the LV8413GP-H by Onsemi. Crafted with precision and expertise, this motion control IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative product ensures smooth and efficient performance. Elevate your projects with the value and advantages that Onsemi brings to the table, providing customers with unbeatable benefits and superior results. Choose the LV8413GP-H for top-notch motion control solutions that deliver exceptional outcomes every time.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic and epoxy material ensures durability and reliability of the package, making it suitable for long-term usage.

Surface Mount YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape SQUARE

Square shape package provides a compact design, ideal for applications where space is limited.

Power Supplies (V) 3.3,5

Support for multiple power supply options provides flexibility in voltage requirements, catering to a variety of system designs.

No. of Terminals 16

A higher number of terminals allow for more connections and functionality, enhancing the versatility of the IC.

Package Style (Meter) CHIP CARRIER

Chip carrier package style offers efficient heat dissipation and compact size, suitable for high-density applications.

Maximum Operating Temperature 85 °C

High maximum operating temperature range ensures stability and performance under varying temperature conditions.

Minimum Operating Temperature -30 °C

Low minimum operating temperature allows for reliable operation even in extreme cold environments.

Terminal Position QUAD

Quad terminal position provides better connectivity and signal integrity, improving overall performance.

Maximum Supply Current (Isup) 1.2 mA

Low maximum supply current requirement helps in reducing power consumption, making the IC energy-efficient.

Technology BICMOS

BICMOS technology offers a combination of bipolar and CMOS characteristics, providing high-speed operation and low power consumption.

Terminal Form NO LEAD

No lead terminal form ensures easy soldering and reliable connections, enhancing the durability of the IC.

Terminal Pitch 0.5 mm

Small terminal pitch allows for compact layout design and high-density interconnection, enabling efficient signal transmission.

Technical Specifications

Motion Control ICs LV8413GP-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV8413GP-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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