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TLE5206-2S

Infineon Technologies

TLE5206-2S by Infineon Technologies

TLE5206-2S by Infineon is a BRUSH DC MOTOR CONTROLLER with 6A output current and 40V max supply voltage. It operates b/w 0-70°C, suitable for motion control applications. The IC features BCDMOS technology, matte tin terminal finish, and flange mount package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 4,819 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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758

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Nova Conductors

Japan . 500 parts In-Stock

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500

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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GES GmbH

Germany . 10 parts In-Stock

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Semicontronic

India . 320 parts In-Stock

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$1.500

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$1.462

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$1.455

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320

$1.500

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Ampacity Inc.

Singapore . 1,359 parts In-Stock

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$6.500

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$6.500

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Modulus Dynamics

Lithuania . 2,954 parts In-Stock

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$7.356

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$7.062

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$6.768

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$6.768

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AZTECH Wire

Italy . 274 parts In-Stock

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$11.294

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Corohmni

South Africa . 188 parts In-Stock

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$24.386

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Andel Nordic

Denmark . 404 parts In-Stock

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$40.080

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$28.054

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$28.054

404

$40.080

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$28.054

$28.054

A-Z Elektronik GmbH

Germany . 7,593 parts In-Stock

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Argo Parts USA

USA . 4,630 parts In-Stock

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Perfect Parts

USA . 2,886 parts In-Stock

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Continental Prestige Electronics

USA . 930 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Kepictronics

USA . 229 parts In-Stock

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Corphita

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211

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Overview

Experience smooth and efficient motion control with the TLE5206-2S by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees high-quality products that deliver reliable performance. Designed for brush DC motor controllers, this motion control IC offers a wide range of applications, providing customers with precise and accurate control over their systems. With a nominal supply voltage of 13.2V and a maximum output current of 6A, the TLE5206-2S ensures optimal functionality while maintaining durability. Upgrade your motion control systems with Infineon's innovative technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and helps in protecting the internal components of the IC, making it durable and reliable for long-term use.

Nominal Supply Voltage (Vsup): 13.2 V

The nominal supply voltage of 13.2V ensures efficient performance of the Motion Control IC, providing the optimal voltage for operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperatures without compromising its functionality, making it suitable for various industrial applications.

Technology: BCDMOS

The BCDMOS technology used in this IC offers a combination of Bipolar, CMOS, and DMOS technologies, providing high efficiency, low power consumption, and fast switching speeds.

Maximum Output Current: 6 A

The maximum output current of 6A allows the IC to drive high-power devices such as DC motors efficiently, making it a versatile choice for motion control applications.

Technical Specifications

Motion Control ICs TLE5206-2S attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Other IC type:

JESD-30 Code:

R-PSFM-T7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP7,.1

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/18

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

TLE5206-2S Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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