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TLE52062GPAUMA1

Infineon Technologies

TLE52062GPAUMA1 by Infineon Technologies

TLE52062GPAUMA1 by Infineon is a Motion Control IC with 20 terminals, BCDMOS technology, and 6A max output current. It is a Brush DC Motor Controller suitable for applications requiring a supply voltage range of 6-40V and compact design with small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,117 parts In-Stock

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Digiode

USA . 489 parts In-Stock

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489

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Semicontronic

India . 340 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

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$3.395

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340

$3.500

$3.412

$3.395

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Aztec Data Supply Inc.

USA . 3,415 parts In-Stock

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$4.490

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$4.490

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Ampacity Inc.

Singapore . 962 parts In-Stock

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$4.500

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962

$4.500

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Corohmni

South Africa . 93 parts In-Stock

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$6.936

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AZTECH Wire

Italy . 454 parts In-Stock

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$13.635

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454

$13.635

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$23.971

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$22.773

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$22.773

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$23.971

$22.773

$22.773

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Modulus Dynamics

Lithuania . 5,033 parts In-Stock

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$24.857

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$23.863

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$22.868

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5,033

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$22.868

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Lixinc

USA . 17,515 parts In-Stock

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Continental Prestige Electronics

USA . 4,786 parts In-Stock

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Argo Parts USA

USA . 4,721 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 270 parts In-Stock

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270

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the power of seamless motion control with the TLE52062GPAUMA1 by Infineon Technologies. Crafted with precision and expertise, this innovative brush DC motor controller offers unparalleled performance and reliability. Ideal for a wide range of applications, this small outline IC provides a nominal supply voltage of 13.2V and a maximum output current of 6A. With Infineon's cutting-edge technology and quality manufacturing, you can trust that your devices will operate at peak efficiency. Elevate your projects with the TLE52062GPAUMA1 and experience the difference it can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and longevity are important factors.

Surface Mount: YES

This product's surface mount capability allows for easy and efficient installation, making it suitable for mass production and assembly line processes.

Package Shape: RECTANGULAR

The rectangular package shape of this product maximizes space efficiency, making it ideal for compact designs and applications with limited space constraints.

Nominal Supply Voltage (Vsup): 13.2 V

With a nominal supply voltage of 13.2V, this product provides a stable and reliable power source for consistent performance in various operating conditions.

No. of Terminals: 20

The 20 terminals on this product allow for versatile connectivity options, making it suitable for a wide range of integration and customization possibilities.

Package Style (Meter): SMALL OUTLINE

The small outline of this package style offers space-saving benefits, making it ideal for designs where size is a critical factor.

Terminal Position: DUAL

The dual terminal position enhances connectivity and functionality, providing flexibility in wiring configurations and making this product suitable for diverse application requirements.

Maximum Seated Height: 3.5 mm

The low maximum seated height of 3.5mm ensures minimal space occupation, making this product ideal for compact and slim designs.

Width (mm): 11 mm

The 11mm width of this product contributes to its compact form factor, suitable for applications where space optimization is crucial.

Other IC type: BRUSH DC MOTOR CONTROLLER

Being a brush DC motor controller, this product offers precise control and efficient operation for brush DC motors, making it an excellent choice for motor control applications.

Minimum Supply Voltage (Vsup): 6 V

With a minimum supply voltage of 6V, this product can operate efficiently even in low power supply conditions, ensuring reliable performance across a wide range of voltage inputs.

Length: 15.9 mm

The 15.9mm length of this product contributes to its compact design, making it suitable for applications where space is limited or dimensions are critical.

Maximum Output Current: 6 A

With a maximum output current of 6A, this product can handle high current loads effectively, making it a reliable choice for applications requiring robust power delivery.

Technology: BCDMOS

The use of BCDMOS technology in this product provides a balance of power efficiency and integration capabilities, making it an optimal choice for energy-efficient and compact designs.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections, ensuring stable performance and ease of installation in various applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product enables precise and convenient soldering or mounting, making it suitable for high-density integration and miniaturized designs.

Maximum Supply Voltage (Vsup): 40 V

The high maximum supply voltage of 40V provides versatility and robustness, making this product suitable for a wide range of power supply conditions and applications.

Technical Specifications

Motion Control ICs TLE52062GPAUMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

11 mm

Trade Compliance

TLE52062GPAUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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