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TLE52052GPAUMA1

Infineon Technologies

TLE52052GPAUMA1 by Infineon Technologies

TLE52052GPAUMA1 by Infineon is a Motion Control IC with 20 terminals, BCDMOS technology, and 6A max output current. Ideal for BRUSH DC MOTOR CONTROL applications due to its 13.2V nominal voltage and compact rectangular package design (15.9mm x 11mm).

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 26,610 parts In-Stock

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Vyrian

USA . 7,428 parts In-Stock

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Digiode

USA . 110 parts In-Stock

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Nova Conductors

Japan . 96 parts In-Stock

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Semicontronic

India . 214 parts In-Stock

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$0.500

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$0.488

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$0.485

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214

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Ampacity Inc.

Singapore . 1,072 parts In-Stock

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$6.500

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Modulus Dynamics

Lithuania . 2,162 parts In-Stock

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$9.007

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$8.647

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$8.286

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AZTECH Wire

Italy . 807 parts In-Stock

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$16.635

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Corohmni

South Africa . 41 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,957 parts In-Stock

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$22.700

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Argo Parts USA

USA . 2,987 parts In-Stock

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Corphita

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Microchip USA

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Continental Prestige Electronics

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Australia . 100 parts In-Stock

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Overview

Unlock the potential of your motion control applications with the TLE52052GPAUMA1 by Infineon Technologies, a leader in innovative semiconductor solutions. This compact and efficient Brush DC Motor Controller offers a maximum output current of 6A, making it ideal for a wide range of industrial and automotive applications. With a nominal supply voltage of 13.2V and a small outline package style, this IC provides exceptional performance and reliability. Experience seamless operation and superior quality with Infineon's cutting-edge technology, setting new standards in motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation and reduces the amount of physical space required for the product.

Nominal Supply Voltage (Vsup): 13.2 V

Optimal voltage for efficient performance of the motion control IC, ensuring stable operation.

No. of Terminals: 20

Provides sufficient connectivity options for various external devices and sensors, allowing for versatile applications.

Maximum Output Current: 6 A

Capable of handling high current loads, making it suitable for driving powerful brush DC motors.

Technology: BCDMOS

Utilizes Bipolar-CMOS-DMOS (BCD) technology for efficient power management and control, enhancing overall performance.

Technical Specifications

Motion Control ICs TLE52052GPAUMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

11 mm

Trade Compliance

TLE52052GPAUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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