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TLE5206-2GP

Infineon Technologies

TLE5206-2GP by Infineon Technologies

TLE5206-2GP by Infineon is a Motion Control IC with 20 terminals, BCDMOS technology, and 6A max output current. It operates b/w 0-70°C, suitable for brush DC motor control applications. With a supply voltage range of 6-40V, it's ideal for small outline designs requiring precise motion control.

Median Price

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Lifecycle Status

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6

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Chip Stock

USA . 338 parts In-Stock

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Nova Conductors

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GES GmbH

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Digiode

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J2 Sourcing AB

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Corohmni

South Africa . 790 parts In-Stock

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$1.898

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Ampacity Inc.

Singapore . 1,045 parts In-Stock

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$5.500

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Semicontronic

India . 508 parts In-Stock

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$6.500

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$6.338

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$6.305

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$8.080

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$7.676

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$7.676

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Modulus Dynamics

Lithuania . 1,990 parts In-Stock

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$8.143

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$7.817

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$7.492

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AZTECH Wire

Italy . 878 parts In-Stock

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$11.807

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Aztec Data Supply Inc.

USA . 184 parts In-Stock

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Component Stockers USA

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GreenTree Electronics

Israel . 21,500 parts In-Stock

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Metaverse IC Inc.

Canada . 20,000 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 6,984 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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Bastille Electronics

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Corphita

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Overview

Enhance your motion control systems with the TLE5206-2GP by Infineon Technologies, a leading manufacturer known for top-quality products. This versatile IC is perfect for various applications in the automotive industry and beyond, offering customers unmatched reliability and performance. With a nominal supply voltage of 13.2V and a maximum output current of 6A, this brush DC motor controller ensures smooth operation and precise control. Upgrade your projects with the TLE5206-2GP and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and resistance to environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic systems, saving time and effort.

Nominal Supply Voltage (Vsup): 13.2 V

The nominal supply voltage of 13.2V provides a stable power source for the motion control IC, ensuring consistent performance.

No. of Terminals: 20

Having 20 terminals allows for versatile and customizable connections, enabling compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this motion control IC can withstand high temperatures, making it suitable for various industrial applications.

Technology: BCDMOS

The BCDMOS technology utilized in this product offers high efficiency and performance, making it an optimal choice for motion control applications.

Technical Specifications

Motion Control ICs TLE5206-2GP attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6/18

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

11 mm

Trade Compliance

TLE5206-2GP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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