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TLE5205-2G

Infineon Technologies

TLE5205-2G by Infineon Technologies

Infineon's TLE5205-2G is a BCDMOS Motion Control IC for brush DC motors. It operates at 6-18V with a peak output current of 6A. With small outline packaging and single terminal position, it's ideal for compact motor control applications.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 20,000 parts In-Stock

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Vyrian

USA . 1,347 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 389 parts In-Stock

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389

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Huijzer Components

Netherlands . 29 parts In-Stock

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ComSIT USA

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Ampacity Inc.

Singapore . 1,422 parts In-Stock

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$5.500

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iBuyXS LLC

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$7.160

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Modulus Dynamics

Lithuania . 4,326 parts In-Stock

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$8.954

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$8.596

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$8.238

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AZTECH Wire

Italy . 632 parts In-Stock

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$14.142

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Corohmni

South Africa . 168 parts In-Stock

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Lixinc

USA . 14,446 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,396 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 716 parts In-Stock

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Argo Parts USA

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Corphita

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Kepictronics

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Enhance your motion control systems with the TLE5205-2G by Infineon Technologies, a high-quality brush DC motor controller that offers superior performance and reliability. Infineon is a trusted manufacturer known for its cutting-edge technology and innovative solutions in the field of motion control ICs. With a compact design and a wide range of applications, this product provides customers with unparalleled value, efficiency, and flexibility. Upgrade your projects with the TLE5205-2G and experience seamless operation like never before.

Feature Benefit Bullets

No. of Functions: 4

Having 4 functions in one product offers versatility and efficiency in managing different tasks within a single component.

Isolation Voltage: 1500 V

High isolation voltage ensures safety and protection against electrical hazards, making this product reliable in various applications.

Packing Method: TAPE & REEL

The tape & reel packaging method allows for easy handling, storage, and automated assembly processes, saving time and effort during production.

Dimensions: L27.81XB12.19XH6.99 (mm)

Compact dimensions make this transformer suitable for applications where space is limited, without compromising on performance.

Application: 1000 BASE-T

Designed specifically for 1000 BASE-T applications, ensuring compatibility and optimal performance in networking and data communication systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this transformer can withstand high temperatures, ensuring long-term reliability and stability in various environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for use in extremely cold conditions, ensuring consistent performance.

Terminal Finish: Matte Tin (Sn) - with Nickel (Ni) barrier

The terminal finish of matte tin with nickel barrier provides excellent conductivity, corrosion resistance, and solderability, enhancing the durability and lifespan of the product.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure installation on PCBs, saving space and facilitating efficient assembly processes.

Turns Ratio (Np:Ns): 1:1

The 1:1 turns ratio ensures equal voltage transformation between primary and secondary windings, making this transformer suitable for balanced signal transmission and precise voltage conversion.

Technical Specifications

Motion Control ICs TLE5205-2G attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

6/18

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Width (mm):

9.25 mm

Trade Compliance

TLE5205-2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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