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TLE5206-2

Infineon Technologies

TLE5206-2 by Infineon Technologies

TLE5206-2 by Infineon: Operates at 6-40V, outputs 6A max current. Ideal for brush DC motor control applications. Features BCDMOS tech, temp range of 0-70°C, and 7 terminals in a rectangular plastic package with matte tin finish.

Median Price

$3.836

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 400 parts In-Stock

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$3.836

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ComSIT Distribution GmbH

Germany . 823 parts In-Stock

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Digiode

USA . 674 parts In-Stock

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Vyrian

USA . 229 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Ampacity Inc.

Singapore . 1,116 parts In-Stock

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$0.500

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Continental Prestige Electronics

USA . 1,504 parts In-Stock

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$3.836

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$3.759

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Argo Parts USA

USA . 498 parts In-Stock

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$3.836

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Modulus Dynamics

Lithuania . 5,444 parts In-Stock

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$3.836

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$3.683

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$3.529

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AZTECH Wire

Italy . 437 parts In-Stock

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$13.986

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Andel Nordic

Denmark . 78 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,460 parts In-Stock

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Corphita

USA . 977 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$3.644

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$3.567

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$3.567

Perfect Parts

USA . 167 parts In-Stock

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Unlock the power of precise motion control with the TLE5206-2 by Infineon Technologies. Crafted with superior quality and expertise, this motion control IC is designed to deliver reliable performance across a wide range of applications. From robotics to automotive systems, this versatile product offers unmatched value and benefits, including high output current capabilities and a wide supply voltage range. Trust Infineon Technologies to bring innovation and excellence to your projects with the TLE5206-2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Nominal Supply Voltage (Vsup): 13.2 V

A stable and optimal supply voltage ensures consistent performance and reliability of the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand extended use in various environments without overheating.

Technology: BCDMOS

BCDMOS technology offers high efficiency and low power consumption, making the product energy-efficient and cost-effective.

Maximum Output Current: 6 A

The high output current capability allows the product to drive motors with ease, making it suitable for a wide range of applications.

Technical Specifications

Motion Control ICs TLE5206-2 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Other IC type:

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

6/18

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TLE5206-2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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