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PDRV8424PWPR

Texas Instruments

PDRV8424PWPR by Texas Instruments

The Texas Instruments PDRV8424PWPR is a Motion Control IC with 28 terminals, operating at -40 to 125°C. It features a 5V nominal voltage and can handle up to 2.5A output current. Ideal for automotive applications, this stepper motor controller comes in a small outline package with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,228 parts In-Stock

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Digiode

USA . 4,435 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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LWI Electronics Inc

India . 18 parts In-Stock

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18

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Distributors (Availability)

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Semicontronic

India . 706 parts In-Stock

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$1.500

100+ parts

$1.462

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$1.455

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706

$1.500

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$1.455

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Ampacity Inc.

Singapore . 1,253 parts In-Stock

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$2.500

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$2.500

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One Stop Electronics

USA . 705 parts In-Stock

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$3.500

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705

$3.500

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AZTECH Wire

Italy . 587 parts In-Stock

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$11.204

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Corohmni

South Africa . 1,042 parts In-Stock

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$16.836

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Parana Technologies

USA . 504 parts In-Stock

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$20.553

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$20.637

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504

$20.553

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$22.631

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$22.631

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ChromeModa Solutions

Germany . 573 parts In-Stock

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$23.093

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$18.936

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IDEA Electronic Components Group

UK . 457 parts In-Stock

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$23.093

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$21.938

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$20.784

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457

$23.093

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Corphita

USA . 4,050 parts In-Stock

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Argo Parts USA

USA . 3,916 parts In-Stock

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Continental Prestige Electronics

USA . 1,668 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience seamless motion control with the PDRV8424PWPR by Texas Instruments, a leading manufacturer known for its superior quality and reliable products. This motion control IC is versatile and ideal for a wide range of applications, offering customers unmatched value, benefits, and advantages. Whether you're looking to optimize automotive systems or enhance industrial automation, this product delivers exceptional performance, precision, and reliability. Trust Texas Instruments to provide cutting-edge technology that meets your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and improving overall PCB design.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in harsh environments or under heavy loads.

Terminal Position: DUAL

Dual terminal position allows for flexible connectivity options and ensures proper signal transmission and control.

Technical Specifications

Motion Control ICs PDRV8424PWPR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Additional Features:

MOTOR SUPPLY VOLTAGE IS 4.5 TO 33 V

Other IC type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

PDRV8424PWPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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