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PDRV8912QPWPRQ1

Texas Instruments

PDRV8912QPWPRQ1 by Texas Instruments

PDRV8912QPWPRQ1 by Texas Instruments is a Motion Control IC with 24 terminals, operating temperature range of -40 to 125 °C. It is an AEC-Q100 compliant IC designed for automotive applications, featuring a supply voltage range of 3-5.5 V and compact dimensions of 7.8mm x 4.4mm x 1.2mm suitable for brush DC motor control in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,521 parts In-Stock

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8,521

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Digiode

USA . 4,951 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,023 parts In-Stock

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$0.500

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1,023

$0.500

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Semicontronic

India . 1,052 parts In-Stock

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$1.500

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$1.462

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$1.455

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1,052

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

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$5.500

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1,041

$5.500

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AZTECH Wire

Italy . 551 parts In-Stock

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$7.028

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551

$7.028

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Corohmni

South Africa . 290 parts In-Stock

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$16.508

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290

$16.508

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Parana Technologies

USA . 1,926 parts In-Stock

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$22.025

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$22.575

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$22.025

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DigiPath Technology Company

USA . 929 parts In-Stock

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$24.252

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$22.312

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929

$24.252

$22.312

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ChromeModa Solutions

Germany . 6,564 parts In-Stock

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$24.747

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$20.293

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6,564

$24.747

$20.293

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IDEA Electronic Components Group

UK . 2,161 parts In-Stock

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$24.747

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$23.510

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$22.272

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2,161

$24.747

$23.510

$22.272

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Corphita

USA . 3,564 parts In-Stock

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Argo Parts USA

USA . 1,932 parts In-Stock

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Continental Prestige Electronics

USA . 624 parts In-Stock

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Bastille Electronics

Australia . 22 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Overview

Enhance your automotive motion control systems with the PDRV8912QPWPRQ1 by Texas Instruments. Designed with quality in mind, this IC offers reliability and precision for a wide range of applications. With Texas Instruments' reputation for excellence, you can trust that this motion control device will meet your needs with ease. Benefit from its compact design, high performance, and automotive-grade features, ensuring optimal functionality in any environment. Upgrade your motion control solutions today with the PDRV8912QPWPRQ1 and experience the superior value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Ease of installation and less circuit board space required, making it ideal for compact designs.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, ensuring performance in harsh environments.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal voltage level for efficient operation, reducing power consumption and heat generation.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options, enhancing compatibility with other components.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Compact design with heat dissipation features and low profile for space-saving integration in various applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance for reliability in demanding operating conditions, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

Wide temperature range support for versatility in usage across different environments and climates.

Terminal Position: DUAL

Dual terminal position for secure and stable connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.2 mm

Low profile design for compact installations, ideal for space-constrained applications.

Width (mm): 4.4 mm

Small width footprint for flexibility in placement within a circuit board layout.

Minimum Supply Voltage (Vsup): 3 V

Supports lower voltage input for energy-efficient operation and compatibility with various power sources.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures stable and secure soldering during assembly process.

Temperature Grade: AUTOMOTIVE

Designed and rated for automotive applications, meeting stringent requirements for reliability and performance.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure mechanical connection, enhancing overall product durability.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density mounting and precise electrical connections, suitable for complex circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard storage and handling practices.

Maximum Supply Voltage (Vsup): 5.5 V

Supports higher supply voltage for versatility in power source options and compatibility with a wider range of systems.

Technical Specifications

Motion Control ICs PDRV8912QPWPRQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED MAIN SUPPLY 4.5 TO 32 V

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

PDRV8912QPWPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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