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LV8413GP-TE-L-E

Onsemi

LV8413GP-TE-L-E by Onsemi

LV8413GP-TE-L-E by Onsemi is a Motion Control IC in PLASTIC/EPOXY package. Operates at -30 to 85 °C with 3.3,5 V supplies. Features BICMOS tech, 16 terminals for quad position applications.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,000 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

29,000

-

$1.360

$1.130

$1.010

Verical

USA . 29,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

29,000

-

-

$1.413

$1.262

DigiKey

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.160

10k+ parts

-

27,000

-

-

$1.160

-

Arrow

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.946

100

-

-

-

$0.946

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 415 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$1.064

-

-

-

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$1.222

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$1.222

-

-

-

Vyrian

USA . 17,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,012

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,413 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

17,413

$0.800

-

-

-

Semicontronic

India . 17,133 parts In-Stock

1+ parts

$0.800

100+ parts

$0.780

1k+ parts

$0.776

10k+ parts

-

17,133

$0.800

$0.780

$0.776

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$0.946

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$0.946

-

-

-

Corphita

USA . 144 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$1.008

-

-

-

Component Stockers USA

USA . 32,748 parts In-Stock

1+ parts

$1.130

100+ parts

$1.050

1k+ parts

$0.960

10k+ parts

$0.960

32,748

$1.130

$1.050

$0.960

$0.960

Argo Parts USA

USA . 4,673 parts In-Stock

1+ parts

$1.222

100+ parts

-

1k+ parts

-

10k+ parts

-

4,673

$1.222

-

-

-

Aztec Data Supply Inc.

USA . 4,919 parts In-Stock

1+ parts

$6.570

100+ parts

-

1k+ parts

-

10k+ parts

-

4,919

$6.570

-

-

-

Continental Prestige Electronics

USA . 31,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.953

10k+ parts

-

31,000

-

-

$0.953

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,546

-

-

-

-

Problanco Electronics

Mexico . 7,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,619

-

-

-

-

Microchip USA

USA . 4,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,984

-

-

-

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Perfect Parts

USA . 2,464 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,464

-

-

-

-

SupplyDigital Components

Austria . 2,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,367

-

-

-

-

TANS Electronics

Latvia . 1,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

-

-

-

-

Kulean Microsystems

USA . 923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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923

-

-

-

-

UHIMA Technologies

Türkiye . 607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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607

-

-

-

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Overview

Elevate your motion control systems with the LV8413GP-TE-L-E by Onsemi, a high-quality chip carrier designed to deliver precision and efficiency. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and reliability in all their products. Ideal for a wide range of applications, this motion control IC offers unmatched value and benefits to customers looking to enhance their systems with cutting-edge technology. Upgrade your projects with the LV8413GP-TE-L-E and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy installation and rework, making the product suitable for various applications.

Package Shape: SQUARE

The square package shape enables efficient use of board space and ensures easy integration into circuit designs.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages gives flexibility in design and compatibility with different systems.

No. of Terminals: 16

The high number of terminals allows for connectivity to various components and peripherals, increasing the product's versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers better thermal performance and protection for the integrated circuits, ensuring reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial applications where temperature fluctuates.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature range ensures the product can operate in a wide range of environments, including cold conditions.

Terminal Position: QUAD

The quad terminal position provides increased connectivity options and ease of routing within the circuit layout.

Maximum Supply Current (Isup): 1.2 mA

The low maximum supply current consumption helps in reducing power consumption and increasing efficiency.

Technology: BICMOS

The use of BiCMOS technology offers a combination of high-speed performance and low-power consumption, making the product suitable for various motion control applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly and reduces the risk of soldering issues during installation.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density integration and compact design of the product, ideal for space-constrained applications.

Technical Specifications

Motion Control ICs LV8413GP-TE-L-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV8413GP-TE-L-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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