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DRV8835DSST

Texas Instruments

DRV8835DSST by Texas Instruments

DRV8835DSST by Texas Instruments is a motion control IC with 12 terminals, operating at 3-7V. It offers a max output current of 1.5A and supports brush DC motor control applications. The small outline package with a very thin profile makes it suitable for compact designs requiring precise motion control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,817 parts In-Stock

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Digiode

USA . 390 parts In-Stock

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390

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 1,296 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 899 parts In-Stock

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$3.500

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$3.412

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$3.395

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899

$3.500

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Ampacity Inc.

Singapore . 1,111 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 638 parts In-Stock

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$8.105

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Corohmni

South Africa . 532 parts In-Stock

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$10.176

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Parana Technologies

USA . 491 parts In-Stock

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$12.115

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$12.524

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ChromeModa Solutions

Germany . 6,648 parts In-Stock

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$13.612

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$11.162

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IDEA Electronic Components Group

UK . 1,380 parts In-Stock

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$12.931

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$12.251

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Continental Prestige Electronics

USA . 6,134 parts In-Stock

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Corphita

USA . 4,726 parts In-Stock

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Argo Parts USA

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DigiPath Technology Company

USA . 1,085 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your motion control applications with the DRV8835DSST by Texas Instruments. Crafted from high-quality materials, this versatile brush DC motor controller offers reliable performance and efficient power management for a wide range of projects. With its small outline and dual terminal position, it's easy to integrate into your designs, providing smooth operation and precise control. Trust in Texas Instruments' reputation for excellence and innovation in motion control ICs, and experience the value and benefits that the DRV8835DSST brings to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for applications where weight and impact resistance are important.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V is a common and convenient voltage level that is compatible with many power sources, making this product versatile in various applications.

No. of Terminals: 12

Having 12 terminals provides flexibility and connectivity options for interfacing with other components in the system, allowing for a more customizable and integrated solution.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style helps in saving space on the PCB, enhancing thermal performance, and allowing for compact and efficient designs.

Maximum Output Current: 1.5 A

The high maximum output current of 1.5A enables the control IC to drive high-power loads such as DC motors effectively, making it suitable for demanding motion control applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for closely spaced connections, enabling more terminals to be accommodated on a limited PCB area, enhancing the product's integration capabilities.

Maximum Supply Voltage (Vsup): 7 V

With a maximum supply voltage of 7V, this product can handle a wide range of input voltage levels, providing flexibility and compatibility with different power sources.

Technical Specifications

Motion Control ICs DRV8835DSST attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 2V TO 11V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-N12

Length:

3 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC12,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3,5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

DRV8835DSST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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