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LV8761V-TLM-E

Onsemi

LV8761V-TLM-E by Onsemi

LV8761V-TLM-E by Onsemi is a Motion Control IC with 36 terminals, operating at -20 to 85°C. It has a power supply of 5,24V and uses BICMOS technology. Ideal for applications requiring precise motion control in compact designs.

Median Price

$2.152

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,376 parts In-Stock

1+ parts

$1.620

100+ parts

$1.460

1k+ parts

$1.330

10k+ parts

-

1,376

$1.620

$1.460

$1.330

-

Rochester

USA . 4,888 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

4,888

-

$2.030

$1.820

$1.710

Verical

USA . 4,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.275

10k+ parts

-

4,696

-

-

$2.275

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DigiKey

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.680

10k+ parts

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1,376

-

-

$2.680

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,958 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

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1,958

$1.539

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.211

100+ parts

-

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300

$2.211

-

-

-

Chip Stock

USA . 65,000 parts In-Stock

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65,000

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Vyrian

USA . 3,004 parts In-Stock

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3,004

-

-

-

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DigiKey Marketplace

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

$2.450

1k+ parts

-

10k+ parts

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1,376

-

$2.450

-

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,857 parts In-Stock

1+ parts

$1.380

100+ parts

$1.346

1k+ parts

$1.339

10k+ parts

-

2,857

$1.380

$1.346

$1.339

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Ampacity Inc.

Singapore . 2,599 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

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2,599

$1.380

-

-

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Corphita

USA . 2,238 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

-

10k+ parts

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2,238

$1.458

-

-

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Continental Prestige Electronics

USA . 1,376 parts In-Stock

1+ parts

$1.620

100+ parts

$1.460

1k+ parts

-

10k+ parts

-

1,376

$1.620

$1.460

-

-

Corohmni

South Africa . 460 parts In-Stock

1+ parts

$1.620

100+ parts

-

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460

$1.620

-

-

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Argo Parts USA

USA . 1,353 parts In-Stock

1+ parts

$2.211

100+ parts

-

1k+ parts

-

10k+ parts

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1,353

$2.211

-

-

-

Advanced Electronics

New Zealand . 97 parts In-Stock

1+ parts

$2.255

100+ parts

$2.255

1k+ parts

$2.255

10k+ parts

-

97

$2.255

$2.255

$2.255

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Aztec Data Supply Inc.

USA . 840 parts In-Stock

1+ parts

$22.530

100+ parts

-

1k+ parts

-

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840

$22.530

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-

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Perfect Parts

USA . 24,528 parts In-Stock

1+ parts

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24,528

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QUARKTWIN TECHNOLOGY LTD

USA . 7,433 parts In-Stock

1+ parts

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7,433

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TANS Electronics

Latvia . 7,184 parts In-Stock

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7,184

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Kulean Microsystems

USA . 6,922 parts In-Stock

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6,922

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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6,000

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-

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Kepictronics

USA . 3,424 parts In-Stock

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3,424

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,133 parts In-Stock

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2,133

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Problanco Electronics

Mexico . 2,107 parts In-Stock

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2,107

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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767

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.167

1k+ parts

$2.100

10k+ parts

$2.056

500

-

$2.167

$2.100

$2.056

Microchip USA

USA . 216 parts In-Stock

1+ parts

-

100+ parts

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216

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-

-

Overview

Enhance your motion control applications with the LV8761V-TLM-E by Onsemi, a top-quality Motion Control IC that offers unparalleled precision and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in performance and durability. Whether you're looking to optimize motor control in automotive systems or industrial automation, this versatile IC delivers exceptional value and efficiency. Trust Onsemi's expertise and elevate your projects with the LV8761V-TLM-E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components.

Surface Mount: YES

Being surface mountable makes the product easy to assemble and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB.

Power Supplies (V): 5,24

The product supports a wide range of power supply voltages, making it versatile and suitable for various applications.

No. of Terminals: 36

With a high number of terminals, the product offers flexibility in connectivity options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style helps in reducing overall board space consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the product to operate efficiently in cold conditions.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides excellent solderability and durability.

Terminal Position: DUAL

The dual terminal position design allows for increased stability and connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing heat damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure and reliable solder joints.

Maximum Supply Current (Isup): 4 mA

With low maximum supply current, the product is energy-efficient and helps in prolonging battery life.

Technology: BICMOS

The BICMOS technology offers a combination of high-speed performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product is suitable for standard surface mount assembly processes.

Technical Specifications

Motion Control ICs LV8761V-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8761V-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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