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LV8727

Onsemi

LV8727 by Onsemi

LV8727 by Onsemi is a Motion Control IC with 24V nominal voltage and 4.6A max output current. Ideal for stepper motor control applications, it operates b/w -30 to 85 °C with a terminal pitch of 1mm in a rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 798 parts In-Stock

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Vyrian

USA . 137 parts In-Stock

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SupplyDigital Components

Austria . 7,923 parts In-Stock

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Problanco Electronics

Mexico . 5,748 parts In-Stock

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TANS Electronics

Latvia . 4,066 parts In-Stock

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Kulean Microsystems

USA . 2,197 parts In-Stock

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Corphita

USA . 1,418 parts In-Stock

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UHIMA Technologies

Türkiye . 898 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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Overview

Experience superior motion control with the LV8727 by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in their products. The LV8727 is perfect for a wide range of applications in the motion control ICs category, offering customers unmatched value, efficiency, and performance. With a nominal supply voltage of 24V and a maximum output current of 4.6A, this stepper motor controller provides the power and precision you need for your projects. Trust Onsemi and elevate your motion control capabilities with the LV8727.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 24 V

Optimal voltage for efficient performance of the motion control ICs.

Maximum Operating Temperature: 85 °C

Allows the product to operate in a wide range of temperatures, making it suitable for various environments.

Technology: BCDMOS

Utilizes BCDMOS technology for efficient and reliable operation of the motion control ICs.

Maximum Output Current: 4.6 A

Capable of providing high output current for driving stepper motors effectively.

Technical Specifications

Motion Control ICs LV8727 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PZFM-T25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

4.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP25,.16,.16,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4.9 mA

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LV8727 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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