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LV8760T-TLM-E

Onsemi

LV8760T-TLM-E by Onsemi

LV8760T-TLM-E by Onsemi is a Motion Control IC with 20 terminals, operating voltage of 5V, and max output current of 4A. Ideal for brush DC motor control applications due to its BICMOS technology, small outline package style, and dual terminal position.

Median Price

$1.587

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,000 parts In-Stock

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$2.240

14,000

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$2.240

Rochester

USA . 833 parts In-Stock

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$1.340

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$1.200

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$1.130

833

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$1.340

$1.200

$1.130

Verical

USA . 800 parts In-Stock

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$1.587

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800

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$1.587

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Distributors (In-Stock)

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Digiode

USA . 282 parts In-Stock

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$1.482

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282

$1.482

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Chip Stock

USA . 17,500 parts In-Stock

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17,500

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Flip Electronics

USA . 14,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,580 parts In-Stock

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Vyrian

USA . 2,106 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,235 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Semicontronic

India . 654 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

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654

$1.330

$1.297

$1.290

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Ampacity Inc.

Singapore . 618 parts In-Stock

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$1.330

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618

$1.330

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Corphita

USA . 241 parts In-Stock

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$1.404

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241

$1.404

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Corohmni

South Africa . 153 parts In-Stock

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$1.560

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153

$1.560

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$6.290

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100

$6.290

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AZTECH Wire

Italy . 788 parts In-Stock

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$15.170

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788

$15.170

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Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$15.521

100+ parts

$14.124

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$12.727

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87

$15.521

$14.124

$12.727

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Perfect Parts

USA . 50,581 parts In-Stock

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Lixinc

USA . 15,145 parts In-Stock

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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TANS Electronics

Latvia . 7,834 parts In-Stock

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Continental Prestige Electronics

USA . 3,327 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,544 parts In-Stock

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Argo Parts USA

USA . 2,534 parts In-Stock

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Problanco Electronics

Mexico . 2,407 parts In-Stock

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Kulean Microsystems

USA . 2,383 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,696 parts In-Stock

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SupplyDigital Components

Austria . 1,377 parts In-Stock

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UHIMA Technologies

Türkiye . 897 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Microchip USA

USA . 305 parts In-Stock

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305

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Elevate your motion control applications with the LV8760T-TLM-E by Onsemi. Crafted with precision and expertise, this innovative product offers unmatched quality and reliability. Designed for peak performance, this Motion Control IC provides seamless operation and efficiency, making it a must-have for any project requiring precise control. Experience the superior craftsmanship of Onsemi and take your applications to new heights with the LV8760T-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the internal components of the Motion Control IC, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and power sources, making this Motion Control IC versatile and easy to integrate.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this Motion Control IC can withstand high temperatures, making it suitable for a variety of industrial and automotive applications.

Technology: BICMOS

Utilizing BICMOS technology, this Motion Control IC offers a good balance between speed and power consumption, making it efficient and effective for controlling brush DC motors.

Technical Specifications

Motion Control ICs LV8760T-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,24

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LV8760T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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