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LV8727-E

Onsemi

LV8727-E by Onsemi

LV8727-E by Onsemi is a Motion Control IC with 24V supply voltage. It has 25 terminals in an IN-LINE package style. Operating temperature ranges from -30 to 85 °C, making it ideal for robotics and automation applications.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

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Digiode

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Chip Stock

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Inventory MP

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Bristol Electronics

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Ampacity Inc.

Singapore . 1,584 parts In-Stock

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AZTECH Wire

Italy . 139 parts In-Stock

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Component Stockers USA

USA . 719 parts In-Stock

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S.R.D Solutions

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SupplyDigital Components

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TANS Electronics

Latvia . 6,628 parts In-Stock

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Problanco Electronics

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Metaverse IC Inc.

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Kepictronics

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Perfect Parts

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Kulean Microsystems

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RC Electronics

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UHIMA Technologies

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Corohmni

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Microchip USA

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Overview

Unlock precision and control with the LV8727-E by Onsemi. Crafted with quality materials and cutting-edge technology, this motion control IC offers unbeatable performance and reliability. From robotics to CNC machines, this versatile product is perfect for a wide range of applications. Experience seamless operation and enhanced efficiency with the LV8727-E. Elevate your projects with Onsemi's commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and mechanical strength are important.

Nominal Supply Voltage (Vsup): 24 V

The 24V supply voltage ensures compatibility with common power systems and provides sufficient power for effective operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environments and ensures reliable performance in various conditions.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Terminal Pitch: 1 mm

The tight terminal pitch of 1mm allows for compact packaging and efficient use of space on a PCB, making the product suitable for compact designs.

Technical Specifications

Motion Control ICs LV8727-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PZIP-T25

JESD-609 Code:

e6

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP25,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4.9 mA

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LV8727-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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