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DRV8244HQDGQRQ1

Texas Instruments

DRV8244HQDGQRQ1 by Texas Instruments

Texas Instruments' DRV8244HQDGQRQ1 is a Motion Control IC with 28 terminals, operating from -40 to 125 °C. It features a peak output current of 21A, BICMOS technology, and AEC-Q100 screening level. Ideal for half-bridge brush DC motor control applications with Vsup ranging from 4.5V to 35V.

Median Price

$6.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,473 parts In-Stock

1+ parts

$3.555

100+ parts

$3.115

1k+ parts

$1.760

10k+ parts

-

5,473

$3.555

$3.115

$1.760

-

Mouser Electronics

USA . 2,367 parts In-Stock

1+ parts

$6.030

100+ parts

$3.890

1k+ parts

$3.850

10k+ parts

$3.260

2,367

$6.030

$3.890

$3.850

$3.260

DigiKey

USA . 701 parts In-Stock

1+ parts

$6.200

100+ parts

$3.997

1k+ parts

$3.851

10k+ parts

-

701

$6.200

$3.997

$3.851

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,122 parts In-Stock

1+ parts

$3.377

100+ parts

-

1k+ parts

-

10k+ parts

-

4,122

$3.377

-

-

-

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$3.687

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$3.687

-

-

-

Vyrian

USA . 2,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,974

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,217 parts In-Stock

1+ parts

$3.020

100+ parts

$2.944

1k+ parts

$2.929

10k+ parts

-

3,217

$3.020

$2.944

$2.929

-

Ampacity Inc.

Singapore . 3,044 parts In-Stock

1+ parts

$3.020

100+ parts

-

1k+ parts

-

10k+ parts

-

3,044

$3.020

-

-

-

Corphita

USA . 4,416 parts In-Stock

1+ parts

$3.200

100+ parts

-

1k+ parts

-

10k+ parts

-

4,416

$3.200

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

$3.469

10k+ parts

-

1,000

$3.613

-

$3.469

-

Continental Prestige Electronics

USA . 4,889 parts In-Stock

1+ parts

$3.687

100+ parts

-

1k+ parts

-

10k+ parts

$3.613

4,889

$3.687

-

-

$3.613

Argo Parts USA

USA . 174 parts In-Stock

1+ parts

$3.687

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$3.687

-

-

-

Microchip USA

USA . 4,992 parts In-Stock

1+ parts

$21.890

100+ parts

$21.750

1k+ parts

$21.680

10k+ parts

$21.620

4,992

$21.890

$21.750

$21.680

$21.620

Overview

Unleash the power of precise motion control with the DRV8244HQDGQRQ1 from Texas Instruments. This top-tier manufacturer's expertise in producing high-quality Motion Control ICs shines through in this cutting-edge product. Ideal for a wide range of applications, this IC offers unparalleled value and benefits to customers looking for seamless control and enhanced performance. Say goodbye to limitations and hello to limitless possibilities with the DRV8244HQDGQRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the Motion Control ICs onto circuit boards, saving time and effort in the assembly process.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets rigorous automotive industry standards, making it a reliable choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, maximizing space efficiency on PCBs and allowing for easy integration into electronic systems.

Nominal Supply Voltage (Vsup): 13.5V

With a nominal supply voltage of 13.5V, this product offers a stable power source to ensure consistent performance in various operating conditions.

No. of Terminals: 28

The high number of terminals (28) allows for versatile connectivity options, enabling the Motion Control ICs to be used in complex control systems.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The small outline, heat sink/slug, thin profile, and shrink pitch package style enhances thermal dissipation and space savings, making it suitable for compact applications with limited space.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, ensuring reliable performance in harsh conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range (from -40°C to 125°C) allows the Motion Control ICs to be used in both cold and hot environments, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term use.

Terminal Position: DUAL

The dual terminal position allows for redundancy and improved reliability in the connections, reducing the risk of signal loss or circuit failure.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm makes this product suitable for compact designs where space constraints are a concern.

Width (mm): 3mm

The compact width of 3mm allows for easy integration into tight spaces, expanding the range of applications where the Motion Control ICs can be used.

Other IC type: HALF BRIDGE BRUSH DC MOTOR CONTROLLER

As a half bridge brush DC motor controller, this product is specifically designed for motor control applications, offering precise control and efficient operation.

Minimum Supply Voltage (Vsup): 4.5V

With a minimum supply voltage of 4.5V, this product can operate efficiently even with lower power input, ideal for battery-powered devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the reliability of solder joints during the manufacturing process, leading to a robust and durable final product.

Length: 7.1mm

The compact length of 7.1mm allows for easy placement on PCBs and integration into space-constrained electronic systems.

Maximum Output Current: 21A

With a maximum output current of 21A, this product can drive high-power motors and components, making it suitable for demanding applications.

Technology: BICMOS

The BICMOS technology used in this product combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering process, ensuring reliable connections and ease of assembly during production.

Terminal Pitch: 0.5mm

The small terminal pitch of 0.5mm allows for high-density mounting on PCBs, enabling more components to be accommodated on a single board.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 35V

The high maximum supply voltage of 35V allows for flexibility in power input options, accommodating a wide range of operating conditions.

Technical Specifications

Motion Control ICs DRV8244HQDGQRQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

7.1 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

21 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

DRV8244HQDGQRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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