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LV8726TA-NH

Onsemi

LV8726TA-NH by Onsemi

LV8726TA-NH by Onsemi is a Motion Control IC with 48 terminals, operating at -40 to 85 °C. It features a 5V nominal voltage, 0.05A max output current, and BCDMOS technology. Ideal for stepper motor control applications in industrial settings due to its compact square package design and low profile heat sink.

Median Price

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Lifecycle Status

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2

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Vyrian

USA . 6,496 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 382 parts In-Stock

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SupplyDigital Components

Austria . 4,986 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 3,599 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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Corohmni

South Africa . 310 parts In-Stock

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Microchip USA

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Corphita

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Overview

Upgrade your motion control systems with the LV8726TA-NH by Onsemi. Designed with precision and reliability in mind, this stepper motor controller offers unparalleled performance in a compact package. Perfect for industrial-grade applications, this IC boasts a wide operating temperature range and high output current capacity. Trust in Onsemi's reputation for quality and innovation to take your projects to the next level. Say goodbye to limitations and hello to endless possibilities with the LV8726TA-NH.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: SQUARE

Square packages are compact and space-efficient, ideal for applications where size is a concern.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard 5V power supplies, making integration into existing systems seamless.

No. of Terminals: 48

Ample number of terminals provide flexibility in connecting various components and peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer options for different mounting and heat dissipation requirements.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and routing, enhancing reliability.

Maximum Seated Height: 1.25 mm

Low profile design saves space and enables compact device designs.

Width (mm): 7 mm

Compact width allows for efficient board space utilization and integration in tight spaces.

Other IC type: STEPPER MOTOR CONTROLLER

Specifically designed for controlling stepper motors, providing precise and accurate motion control.

Minimum Supply Voltage (Vsup): 2.7 V

Wide operating voltage range allows compatibility with different power sources.

Length: 7 mm

Compact length contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade components are rugged and reliable, suitable for harsh environments.

Maximum Output Current: 0.05 A

Capable of delivering sufficient current for driving motion control components.

Technology: BCDMOS

BCDMOS technology combines the benefits of bipolar and CMOS technologies for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections and ensure reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and enables compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

Wide voltage range ensures compatibility with a variety of power sources and stability in varying supply conditions.

Technical Specifications

Motion Control ICs LV8726TA-NH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 9 TO 55 SUPPLY

Other IC type:

JESD-30 Code:

S-XQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.05 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

LV8726TA-NH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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