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LV8713T-TLM-H

Onsemi

LV8713T-TLM-H by Onsemi

LV8713T-TLM-H by Onsemi is a Motion Control IC with 24 terminals, operating at -20 to 85°C. It features power supplies of 3.3V and 12V, BICMOS technology, and a peak reflow temperature of 260°C. Ideal for applications requiring precise motion control in compact designs.

Median Price

$2.473

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 675 parts In-Stock

1+ parts

$2.400

100+ parts

$1.488

1k+ parts

$0.900

10k+ parts

-

675

$2.400

$1.488

$0.900

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$2.547

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-

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39

$2.547

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Chip Stock

USA . 29,000 parts In-Stock

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29,000

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Vyrian

USA . 5,034 parts In-Stock

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5,034

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Digiode

USA . 1,972 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,875 parts In-Stock

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1,875

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Dan-Mar Components

USA . 1,775 parts In-Stock

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1,775

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Bas Electronics GmbH & Co. KG

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,590 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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1,590

$0.500

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-

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.065

100+ parts

$1.065

1k+ parts

$1.065

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40

$1.065

$1.065

$1.065

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Aztec Data Supply Inc.

USA . 2,927 parts In-Stock

1+ parts

$1.390

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-

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2,927

$1.390

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Corohmni

South Africa . 324 parts In-Stock

1+ parts

$2.496

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324

$2.496

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Continental Prestige Electronics

USA . 2,878 parts In-Stock

1+ parts

$2.547

100+ parts

-

1k+ parts

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10k+ parts

$2.496

2,878

$2.547

-

-

$2.496

Argo Parts USA

USA . 429 parts In-Stock

1+ parts

$2.547

100+ parts

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429

$2.547

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Semicontronic

India . 615 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

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615

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 423 parts In-Stock

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$9.916

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423

$9.916

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QUARKTWIN TECHNOLOGY LTD

USA . 28,299 parts In-Stock

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Perfect Parts

USA . 9,797 parts In-Stock

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TANS Electronics

Latvia . 7,605 parts In-Stock

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7,605

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Kulean Microsystems

USA . 6,723 parts In-Stock

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6,723

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SupplyDigital Components

Austria . 5,815 parts In-Stock

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Problanco Electronics

Mexico . 5,357 parts In-Stock

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Microchip USA

USA . 4,587 parts In-Stock

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Kepictronics

USA . 3,960 parts In-Stock

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Metaverse IC Inc.

Canada . 3,460 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,962 parts In-Stock

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1,962

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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806

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Corphita

USA . 623 parts In-Stock

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623

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of precise motion control with the LV8713T-TLM-H by Onsemi. Crafted with high-quality materials and cutting-edge technology, this motion control IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product is designed to meet the needs of even the most demanding projects. Experience seamless operation and efficiency like never before with the LV8713T-TLM-H. Elevate your projects to new heights with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product.

Surface Mount: YES

The surface mount design allows for easy and convenient installation on PCBs, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and space-saving design, ideal for applications with limited space.

Power Supplies (V): 3.3,12

Support for multiple power supplies of 3.3V and 12V makes this product versatile and compatible with a wide range of systems.

No. of Terminals: 24

With 24 terminals, this product provides ample connectivity options for various input and output signals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance in demanding environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows for reliable operation even in extreme cold conditions.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish enhances solderability and reliability of the connections.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is suitable for a wide range of environments with varying humidity levels.

Technical Specifications

Motion Control ICs LV8713T-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.7 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8713T-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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