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LV8761V-MPB-E

Onsemi

LV8761V-MPB-E by Onsemi

LV8761V-MPB-E by Onsemi is a Motion Control IC with 36 terminals, operating at -20 to 85°C. It has a power supply of 5-24V and uses BICMOS technology. Ideal for applications requiring precise motion control in compact spaces.

Median Price

$2.275

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,241 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

4,241

-

$2.030

$1.820

$1.710

DigiKey

USA . 4,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.340

10k+ parts

$2.340

4,241

-

-

$2.340

$2.340

Verical

USA . 1,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.275

10k+ parts

$2.138

1,592

-

-

$2.275

$2.138

Distributors (In-Stock)

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Digiode

USA . 471 parts In-Stock

1+ parts

$2.138

100+ parts

-

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-

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471

$2.138

-

-

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Vyrian

USA . 4,100 parts In-Stock

1+ parts

-

100+ parts

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4,100

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-

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DigiKey Marketplace

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

$2.340

1k+ parts

-

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1,802

-

$2.340

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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-

Distributors (Availability)

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Semicontronic

India . 3,798 parts In-Stock

1+ parts

$1.910

100+ parts

$1.862

1k+ parts

$1.853

10k+ parts

-

3,798

$1.910

$1.862

$1.853

-

Ampacity Inc.

Singapore . 3,747 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

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10k+ parts

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3,747

$1.910

-

-

-

Corphita

USA . 142 parts In-Stock

1+ parts

$2.025

100+ parts

-

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142

$2.025

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Corohmni

South Africa . 140 parts In-Stock

1+ parts

$2.250

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-

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140

$2.250

-

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Aztec Data Supply Inc.

USA . 1,144 parts In-Stock

1+ parts

$18.610

100+ parts

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1,144

$18.610

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QUARKTWIN TECHNOLOGY LTD

USA . 21,103 parts In-Stock

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21,103

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Kulean Microsystems

USA . 7,978 parts In-Stock

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7,978

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Problanco Electronics

Mexico . 4,018 parts In-Stock

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4,018

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Argo Parts USA

USA . 3,678 parts In-Stock

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3,678

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Continental Prestige Electronics

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

$1.920

1k+ parts

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1,802

-

$1.920

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TANS Electronics

Latvia . 1,086 parts In-Stock

1+ parts

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1,086

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SupplyDigital Components

Austria . 517 parts In-Stock

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517

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Microchip USA

USA . 269 parts In-Stock

1+ parts

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269

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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UHIMA Technologies

Türkiye . 98 parts In-Stock

1+ parts

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98

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Elevate your motion control applications with the LV8761V-MPB-E by Onsemi. Crafted with precision and expertise, this motion control IC delivers unparalleled quality and reliability. Whether you're in robotics, drones, or industrial automation, this product's advanced technology ensures seamless performance. With a compact design and easy installation, it offers exceptional value and efficiency to customers. Trust Onsemi for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to impact, making the product suitable for rugged environments.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making the product suitable for compact applications.

Power Supplies (V): 5,24

Support for multiple voltage inputs provides flexibility in powering the product and compatibility with a range of systems.

No. of Terminals: 36

Having a higher number of terminals allows for more connectivity options, enabling complex control configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

This finish provides good corrosion resistance and solderability, enhancing the product's reliability and longevity.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Motion Control ICs LV8761V-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LV8761V-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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