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LV8713T-MPB-H

Onsemi

LV8713T-MPB-H by Onsemi

LV8713T-MPB-H by Onsemi is a motion control IC with 24 terminals and power supplies of 3.3V and 12V. It operates in temperatures ranging from -20°C to 85°C and has a max supply current of 1.7mA. This IC is suitable for applications requiring precise motion control in various industries.

Median Price

$2.138

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 737 parts In-Stock

1+ parts

-

100+ parts

$1.910

1k+ parts

$1.710

10k+ parts

$1.610

737

-

$1.910

$1.710

$1.610

DigiKey

USA . 737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.510

10k+ parts

-

737

-

-

$2.510

-

Verical

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.138

10k+ parts

$2.013

412

-

-

$2.138

$2.013

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,360 parts In-Stock

1+ parts

$2.014

100+ parts

-

1k+ parts

-

10k+ parts

-

1,360

$2.014

-

-

-

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$2.081

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$2.081

-

-

-

Vyrian

USA . 4,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,718

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 605 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$1.590

-

-

-

Corohmni

South Africa . 128 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$1.870

-

-

-

Corphita

USA . 1,755 parts In-Stock

1+ parts

$1.908

100+ parts

-

1k+ parts

-

10k+ parts

-

1,755

$1.908

-

-

-

Argo Parts USA

USA . 3,022 parts In-Stock

1+ parts

$2.081

100+ parts

-

1k+ parts

-

10k+ parts

-

3,022

$2.081

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.081

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2.081

-

-

-

AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$12.930

100+ parts

-

1k+ parts

-

10k+ parts

-

839

$12.930

-

-

-

Kulean Microsystems

USA . 6,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,239

-

-

-

-

Problanco Electronics

Mexico . 4,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,780

-

-

-

-

SupplyDigital Components

Austria . 1,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,554

-

-

-

-

TANS Electronics

Latvia . 1,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

-

-

-

-

UHIMA Technologies

Türkiye . 948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

948

-

-

-

-

Continental Prestige Electronics

USA . 737 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

-

10k+ parts

-

737

-

$1.810

-

-

Perfect Parts

USA . 559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

559

-

-

-

-

Microchip USA

USA . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

491

-

-

-

-

GreenTree Electronics

Israel . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Overview

Discover the power of motion control with the LV8713T-MPB-H by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers exceptional quality and reliability. This product falls under the category of Motion Control ICs, making it ideal for applications that require precise movement. With its compact and sleek design, this IC offers seamless integration and saves space. The LV8713T-MPB-H supports multiple power supplies, ensuring flexibility in various setups. Experience the benefits of this product, including efficient power consumption and optimized performance. Upgrade your systems today with the LV8713T-MPB-H and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and reliability, making it a great choice for long-term and rugged applications.

Surface Mount: YES

With surface mount capability, this product offers easy and efficient installation, making it suitable for compact and space-constrained designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration and mounting on printed circuit boards, making this product versatile and user-friendly.

Power Supplies (V): 3.3,12

Supporting both 3.3V and 12V power supplies, this motion control IC offers flexibility and compatibility with different voltage requirements, expanding its usability.

No. of Terminals: 24

With 24 terminals, this product provides ample connectivity options, enabling seamless integration with various external devices and components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this IC offers space-saving advantages and facilitates tighter PCB designs, making it an excellent choice for compact applications.

Maximum Operating Temperature: 85 °C

This product's ability to withstand high operating temperatures up to 85°C ensures reliable performance in demanding environments and makes it suitable for industrial applications.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20°C, this motion control IC can operate in cold environments, making it suitable for a wide range of temperature-sensitive applications.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish enhances solderability and ensures a secure electrical connection, making this product highly reliable and effective.

Terminal Position: DUAL

Featuring dual terminal positions, this motion control IC allows for flexible mounting options and provides ease of use during installation and troubleshooting.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum time of 30 seconds at its peak reflow temperature, making it highly resistant to thermal stress during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this motion control IC can endure high-temperature reflow soldering operations, ensuring reliable solder joints and longevity.

Maximum Supply Current (Isup): 1.7 mA

The low maximum supply current consumption of 1.7 mA contributes to energy efficiency and longer battery life, making this product an optimal choice for portable and power-constrained applications.

Technology: BICMOS

Utilizing bipolar complementary metal-oxide-semiconductor (BiCMOS) technology, this motion control IC offers a combination of analog and digital functions, providing excellent performance and versatile applications.

Terminal Form: GULL WING

Featuring gull-wing terminal form, this product ensures secure and easy soldering onto printed circuit boards, enhancing the reliability and manufacturability of the end product.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm enables high-density packaging and enhances the overall miniaturization of the circuit, making this motion control IC suitable for compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate moisture exposure, ensuring its reliability and longevity in varied environmental conditions.

Technical Specifications

Motion Control ICs LV8713T-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.7 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8713T-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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