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L6208N

STMicroelectronics

L6208N by STMicroelectronics

L6208N by STMicroelectronics is a Motion Control IC with 24 terminals, operating voltage range of 8-52V, and max output current of 5.6A. Ideal for automotive applications, this BCDMOS technology-based IC is designed for stepper motor control in various systems.

Median Price

$5.457

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

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$5.457

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48

$5.457

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Vyrian

USA . 5,468 parts In-Stock

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5,468

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Digiode

USA . 3,288 parts In-Stock

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3,288

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Anansix

USA . 1,481 parts In-Stock

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1,481

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Chip Stock

USA . 135 parts In-Stock

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135

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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35

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LittleDiode

UK . 12 parts In-Stock

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12

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Distributors (Availability)

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Ampacity Inc.

Singapore . 439 parts In-Stock

1+ parts

$0.500

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-

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439

$0.500

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Semicontronic

India . 921 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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-

921

$1.500

$1.462

$1.455

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Netroflash

USA . 100 parts In-Stock

1+ parts

$5.457

100+ parts

$5.348

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100

$5.457

$5.348

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Corohmni

South Africa . 9 parts In-Stock

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$5.457

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9

$5.457

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Aztec Data Supply Inc.

USA . 2,401 parts In-Stock

1+ parts

$12.440

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2,401

$12.440

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AZTECH Wire

Italy . 538 parts In-Stock

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$13.327

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538

$13.327

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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$14.032

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$12.629

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$14.032

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$12.629

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Advanced Electronics

New Zealand . 34 parts In-Stock

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$15.425

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$14.037

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$12.648

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34

$15.425

$14.037

$12.648

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Microchip USA

USA . 325 parts In-Stock

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$20.782

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325

$20.782

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MKK Technologies

India . 424 parts In-Stock

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$26.386

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424

$26.386

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DigiPath Technology Company

USA . 424 parts In-Stock

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$26.386

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424

$26.386

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Kepictronics

USA . 7,140 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,383 parts In-Stock

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Lixinc

USA . 4,709 parts In-Stock

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Corphita

USA . 4,402 parts In-Stock

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4,402

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Alle Elektronik GmbH

Germany . 4,255 parts In-Stock

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Continental Prestige Electronics

USA . 2,497 parts In-Stock

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Parana Technologies

USA . 2,235 parts In-Stock

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$16.777

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$16.777

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Infinite Electronics LLP (Excess)

. 974 parts In-Stock

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974

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Argo Parts USA

USA . 543 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Revolutionize your motion control systems with the L6208N by STMicroelectronics. This high-quality Motion Control IC boasts superior performance and reliability, thanks to its innovative BCDMOS technology. Ideal for a wide range of applications, including stepper motor control, this IC offers customers unparalleled value and benefits. With a wide supply voltage range, high output current, and automotive-grade temperature rating, the L6208N is a must-have for any motion control project. Upgrade your systems today with STMicroelectronics' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Nominal Supply Voltage (Vsup): 48 V

Operating at a nominal supply voltage of 48V allows for efficient power usage and compatibility with standard power sources.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this product can withstand elevated temperatures without compromising performance, suitable for demanding environments.

Technology: BCDMOS

BCDMOS technology offers high efficiency and low power consumption, making this product a reliable and energy-efficient choice for motion control applications.

Technical Specifications

Motion Control ICs L6208N attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.75 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

52 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

L6208N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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