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LV8411GR-E

Onsemi

LV8411GR-E by Onsemi

LV8411GR-E by Onsemi is a Motion Control IC in a PLASTIC/EPOXY square package. Operates at -30 to 85 °C with 3.3-5V power supplies, BICMOS tech, and 24 terminals in a CHIP CARRIER style. Ideal for applications requiring precise motion control in compact designs.

Median Price

$2.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,048 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

3,048

-

$2.090

$1.870

$1.760

Verical

USA . 2,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.337

10k+ parts

-

2,940

-

-

$2.337

-

Farnell

UK . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.060

490

-

-

-

$2.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 841 parts In-Stock

1+ parts

$2.214

100+ parts

-

1k+ parts

-

10k+ parts

-

841

$2.214

-

-

-

Vyrian

USA . 6,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,462

-

-

-

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ComSIT Distribution GmbH

Germany . 589 parts In-Stock

1+ parts

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589

-

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Elcom Components

USA . 1 parts In-Stock

1+ parts

-

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-

1k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 72 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$2.060

-

-

-

Corphita

USA . 2,147 parts In-Stock

1+ parts

$2.097

100+ parts

-

1k+ parts

-

10k+ parts

-

2,147

$2.097

-

-

-

AZTECH Wire

Italy . 933 parts In-Stock

1+ parts

$22.230

100+ parts

-

1k+ parts

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933

$22.230

-

-

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Problanco Electronics

Mexico . 6,948 parts In-Stock

1+ parts

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100+ parts

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6,948

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Kulean Microsystems

USA . 5,829 parts In-Stock

1+ parts

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5,829

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SupplyDigital Components

Austria . 3,550 parts In-Stock

1+ parts

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100+ parts

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3,550

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-

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TANS Electronics

Latvia . 2,697 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,697

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-

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UHIMA Technologies

Türkiye . 895 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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895

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-

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Continental Prestige Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.250

10k+ parts

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490

-

-

$2.250

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Perfect Parts

USA . 274 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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274

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Microchip USA

USA . 105 parts In-Stock

1+ parts

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100+ parts

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105

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Overview

Experience the next level of motion control with the LV8411GR-E by Onsemi. Crafted with precision and expertise, this innovative product opens up a world of possibilities for applications in various industries. From robotics to automotive systems, this Motion Control IC delivers unparalleled performance and efficiency. Discover the quality and reliability that Onsemi is known for, and elevate your projects with the cutting-edge technology of the LV8411GR-E. Unlock the potential of your designs and take your creations to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for space-constrained applications.

Power Supplies (V): 3.3,5

Support for multiple power supply options (3.3V, 5V) offers flexibility for various system requirements.

No. of Terminals: 24

A higher number of terminals (24) allow for more connections, enabling versatile usage in different applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good heat dissipation and electrical performance, enhancing the overall reliability and durability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures reliable operation even in extreme cold environments.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal routing and reduces signal interference, improving overall performance.

Maximum Supply Current (Isup): 1.2 mA

The low maximum supply current of 1.2 mA helps in conserving power and ensuring energy efficiency.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and enhances reliability by eliminating potential solder joint failures.

Terminal Pitch: 0.4 mm

With a small terminal pitch of 0.4 mm, this product enables high-density mounting and saves valuable PCB space.

Technical Specifications

Motion Control ICs LV8411GR-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N24

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.13SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

LV8411GR-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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