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LV8406T-TLM-E

Onsemi

LV8406T-TLM-E by Onsemi

LV8406T-TLM-E by Onsemi is a Motion Control IC with 20 terminals, operating voltage of 3.6V, and BICMOS technology. It has a small outline package suitable for surface mount applications. With an operating temperature range from -30 °C to 85°C, it is ideal for various motion control systems.

Median Price

$1.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23,490 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$0.921

10k+ parts

$0.821

23,490

-

$1.110

$0.921

$0.821

DigiKey

USA . 23,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.950

10k+ parts

$0.950

23,490

-

-

$0.950

$0.950

Farnell

UK . 23,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.803

23,490

-

-

-

$0.803

Verical

USA . 21,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.152

10k+ parts

$1.027

21,656

-

-

$1.152

$1.027

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 230 parts In-Stock

1+ parts

$0.803

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$0.803

-

-

-

Digiode

USA . 1,302 parts In-Stock

1+ parts

$0.864

100+ parts

-

1k+ parts

-

10k+ parts

-

1,302

$0.864

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 22,681 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

22,681

$0.680

-

-

-

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$0.803

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$0.803

-

-

-

Corphita

USA . 1,654 parts In-Stock

1+ parts

$0.819

100+ parts

-

1k+ parts

-

10k+ parts

-

1,654

$0.819

-

-

-

Component Stockers USA

USA . 25,187 parts In-Stock

1+ parts

$0.940

100+ parts

$0.880

1k+ parts

$0.800

10k+ parts

$0.800

25,187

$0.940

$0.880

$0.800

$0.800

Continental Prestige Electronics

USA . 23,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.777

10k+ parts

-

23,490

-

-

$0.777

-

Perfect Parts

USA . 12,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,506

-

-

-

-

TANS Electronics

Latvia . 7,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,850

-

-

-

-

Kepictronics

USA . 5,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,138

-

-

-

-

Metaverse IC Inc.

Canada . 4,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,638

-

-

-

-

SupplyDigital Components

Austria . 4,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,156

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

-

-

-

-

Kulean Microsystems

USA . 2,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,085

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Problanco Electronics

Mexico . 1,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

-

-

-

-

GreenTree Electronics

Israel . 1,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,829

-

-

-

-

Assy Fe

Spain . 1,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,475

-

-

-

-

UHIMA Technologies

Türkiye . 588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

588

-

-

-

-

Microchip USA

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Overview

Experience unparalleled precision and reliability with the LV8406T-TLM-E motion control IC by Onsemi. As a leader in the industry, Onsemi's commitment to quality shines through in every aspect of this product. Ideal for a variety of applications, this IC offers customers exceptional value and benefits, ensuring seamless performance and efficiency. Elevate your projects with the LV8406T-TLM-E and discover the advantages that come with choosing a trusted manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and reducing assembly time.

Power Supplies (V): 3,6

Support for multiple power supply voltages (3V and 6V) allows for flexibility in design and compatibility with various systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch enables space-saving design and efficient utilization of board space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in demanding thermal conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good conductivity and solderability, enhancing the reliability of connections and minimizing signal loss.

Technology: BICMOS

The use of BICMOS technology offers a combination of high-speed performance and low power consumption, making the product efficient and reliable.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Technical Specifications

Motion Control ICs LV8406T-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3,6

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV8406T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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