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VNH3ASP30-E

STMicroelectronics

VNH3ASP30-E by STMicroelectronics

VNH3ASP30-E by STMicroelectronics is a Motion Control IC with 30 terminals, suitable for BRUSH DC MOTOR CONTROL. It operates at 5.5-16 V, providing a max output current of 60 A. The package style is SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH in plastic/epoxy material.

Median Price

$4.054

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$4.054

100+ parts

-

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870

$4.054

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Chip Stock

USA . 3,400 parts In-Stock

1+ parts

-

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3,400

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Anansix

USA . 2,393 parts In-Stock

1+ parts

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2,393

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Vyrian

USA . 2,233 parts In-Stock

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2,233

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Digiode

USA . 2,149 parts In-Stock

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2,149

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Cyclops Electronics Ltd

UK . 396 parts In-Stock

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-

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396

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,014 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,014

$0.500

$0.488

$0.485

-

Ampacity Inc.

Singapore . 967 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

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-

967

$3.500

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$5.668

100+ parts

$5.158

1k+ parts

$4.648

10k+ parts

-

200

$5.668

$5.158

$4.648

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IDEA Electronic Components Group

UK . 1,803 parts In-Stock

1+ parts

$6.738

100+ parts

-

1k+ parts

$6.064

10k+ parts

-

1,803

$6.738

-

$6.064

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$9.540

100+ parts

-

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351

$9.540

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MKK Technologies

India . 1,245 parts In-Stock

1+ parts

$12.671

100+ parts

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1,245

$12.671

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DigiPath Technology Company

USA . 1,245 parts In-Stock

1+ parts

$12.671

100+ parts

-

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1,245

$12.671

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Aztec Data Supply Inc.

USA . 258 parts In-Stock

1+ parts

$14.390

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258

$14.390

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$21.218

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156

$21.218

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Lixinc

USA . 19,407 parts In-Stock

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19,407

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Microchip USA

USA . 4,414 parts In-Stock

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4,414

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Corphita

USA . 2,934 parts In-Stock

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2,934

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Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

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100+ parts

$8.056

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2,050

-

$8.056

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Kepictronics

USA . 404 parts In-Stock

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404

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Argo Parts USA

USA . 259 parts In-Stock

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259

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.973

1k+ parts

$3.851

10k+ parts

$3.770

100

-

$3.973

$3.851

$3.770

Overview

Unlock the power of precision and control with the VNH3ASP30-E by STMicroelectronics. As a leader in motion control ICs, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. This BRUSH DC MOTOR CONTROLLER boasts a maximum output current of 60A, providing unmatched performance and reliability. With a compact design and dual terminal position, this product offers customers unparalleled value and efficiency. Trust STMicroelectronics to take your projects to the next level with the VNH3ASP30-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for applications where weight and durability are important.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it an efficient choice for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape is versatile and easy to work with, fitting well into various design layouts.

Nominal Supply Voltage (Vsup): 9 V

With a nominal supply voltage of 9V, this product is compatible with a wide range of power sources, offering flexibility in different applications.

Power Supplies (V): 9/16

The dual power supply options of 9V and 16V provide versatility and allow for compatibility with different power sources.

No. of Terminals: 30

The large number of terminals (30) provide ample connectivity options, making this product suitable for complex control systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline design with a heat sink/slug and shrink pitch ensures efficient heat dissipation and space-saving features for improved performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and ensures reliable connections in the long run.

Terminal Position: DUAL

The dual terminal position provides flexibility in mounting and connectivity options, making it an adaptable choice for various applications.

Maximum Seated Height: 2.35 mm

The low maximum seated height allows for a compact design, ideal for space-constrained applications.

Technical Specifications

Motion Control ICs VNH3ASP30-E attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e3

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Output Current:

60 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

9/16

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

16 mm

Trade Compliance

VNH3ASP30-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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