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VNH3SP30

STMicroelectronics

VNH3SP30 by STMicroelectronics

VNH3SP30 by STMicroelectronics is a Motion Control IC with 2 functions, suitable for BRUSH DC MOTOR CONTROL. It operates at 9-36 V and can handle up to 30 A output current. This small outline IC in plastic/epoxy package is surface mountable and has dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,598 parts In-Stock

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4,598

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Chip Stock

USA . 4,400 parts In-Stock

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4,400

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Anansix

USA . 1,541 parts In-Stock

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1,541

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Vyrian

USA . 632 parts In-Stock

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632

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$2.482

100+ parts

-

1k+ parts

$2.234

10k+ parts

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2,124

$2.482

-

$2.234

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Semicontronic

India . 1,419 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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-

1,419

$2.500

$2.438

$2.425

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$4.293

100+ parts

$4.078

1k+ parts

$4.078

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-

200

$4.293

$4.078

$4.078

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MKK Technologies

India . 468 parts In-Stock

1+ parts

$4.668

100+ parts

-

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468

$4.668

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$4.668

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-

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468

$4.668

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Ampacity Inc.

Singapore . 1,197 parts In-Stock

1+ parts

$5.500

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1,197

$5.500

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Aztec Data Supply Inc.

USA . 145 parts In-Stock

1+ parts

$7.790

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145

$7.790

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$9.701

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95

$9.701

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AZTECH Wire

Italy . 732 parts In-Stock

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$11.789

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732

$11.789

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Kepictronics

USA . 20,000 parts In-Stock

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Lixinc

USA . 7,283 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,097 parts In-Stock

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7,097

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Continental Prestige Electronics

USA . 5,436 parts In-Stock

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5,436

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Argo Parts USA

USA . 4,730 parts In-Stock

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4,730

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 2,161 parts In-Stock

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$2.968

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2,161

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$2.968

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Corphita

USA . 982 parts In-Stock

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982

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 61 parts In-Stock

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61

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Computer Components Inc. - USA

USA . 5 parts In-Stock

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5

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Overview

Unleash the power of motion control with the VNH3SP30 by STMicroelectronics. This high-quality IC offers unparalleled performance and reliability, making it the top choice for a wide range of applications. From brush DC motor controllers to robotics, this versatile product delivers exceptional value and benefits to customers. Trust in the expertise of STMicroelectronics and experience the advantages of the VNH3SP30 for yourself. Elevate your motion control projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact designs, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one IC reduces the need for additional components, simplifying the design and reducing overall costs.

Nominal Supply Voltage (Vsup): 9 V

The nominal supply voltage of 9 V provides a stable power source for the IC, ensuring reliable performance.

Maximum Output Current: 30 A

The high maximum output current of 30 A allows the IC to drive powerful motors or other high-current devices with ease.

Technical Specifications

Motion Control ICs VNH3SP30 attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e3

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

30

Maximum Output Current:

30 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

9/18

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

16 mm

Trade Compliance

VNH3SP30 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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