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VNH2SP30TR-E

STMicroelectronics

VNH2SP30TR-E by STMicroelectronics

VNH2SP30TR-E by STMicroelectronics is a Motion Control IC with 30 terminals, operating at 9-16 V. It features a max output current of 30 A and supports brush DC motor control applications. The package style is small outline with heat sink, suitable for surface mount assembly in various electronic devices.

Median Price

$10.705

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.410

100+ parts

-

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50

$5.410

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Bristol Electronics

USA . 1 parts In-Stock

1+ parts

$16.000

100+ parts

-

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1

$16.000

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Anansix

USA . 2,842 parts In-Stock

1+ parts

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2,842

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Vyrian

USA . 2,719 parts In-Stock

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2,719

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Digiode

USA . 1,336 parts In-Stock

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1,336

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Chip Stock

USA . 140 parts In-Stock

1+ parts

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140

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Microfarads

USA . 21 parts In-Stock

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21

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North Shore Components

USA . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 265 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

265

$0.500

$0.488

$0.485

-

IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$3.355

100+ parts

-

1k+ parts

$3.020

10k+ parts

-

1,611

$3.355

-

$3.020

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$5.302

100+ parts

-

1k+ parts

$5.090

10k+ parts

-

50

$5.302

-

$5.090

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Continental Prestige Electronics

USA . 6,828 parts In-Stock

1+ parts

$5.410

100+ parts

-

1k+ parts

-

10k+ parts

$5.302

6,828

$5.410

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-

$5.302

Corohmni

South Africa . 639 parts In-Stock

1+ parts

$5.410

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639

$5.410

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MKK Technologies

India . 2,161 parts In-Stock

1+ parts

$6.309

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2,161

$6.309

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DigiPath Technology Company

USA . 2,161 parts In-Stock

1+ parts

$6.309

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2,161

$6.309

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Ampacity Inc.

Singapore . 494 parts In-Stock

1+ parts

$7.500

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494

$7.500

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AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$8.511

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742

$8.511

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Aztec Data Supply Inc.

USA . 239 parts In-Stock

1+ parts

$11.070

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239

$11.070

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Microchip USA

USA . 499 parts In-Stock

1+ parts

$16.669

100+ parts

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499

$16.669

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Advanced Electronics

New Zealand . 91 parts In-Stock

1+ parts

$17.954

100+ parts

$16.338

1k+ parts

$14.722

10k+ parts

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91

$17.954

$16.338

$14.722

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Argo Parts USA

USA . 3,804 parts In-Stock

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3,804

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Perfect Parts

USA . 3,427 parts In-Stock

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3,427

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Lixinc

USA . 1,115 parts In-Stock

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Corphita

USA . 1,030 parts In-Stock

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1,030

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Parana Technologies

USA . 565 parts In-Stock

1+ parts

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100+ parts

$4.012

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565

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$4.012

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Overview

Discover the VNH2SP30TR-E by STMicroelectronics, a cutting-edge Motion Control IC designed to revolutionize your projects. With a focus on quality and innovation, STMicroelectronics leads the industry in providing top-notch solutions for motion control applications. Whether you're working on robotics, automotive systems, or industrial automation, this small outline package offers unparalleled performance and reliability. Experience the benefits of seamless integration, high output current, and versatile terminal options. Upgrade your designs with the VNH2SP30TR-E and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for applications requiring motion control ICs.

Surface Mount: YES

With the ability to be surface-mounted, this product is easy to install and saves space on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards, optimizing space and improving overall design.

Nominal Supply Voltage (Vsup): 9 V

The nominal supply voltage of 9V ensures compatibility with a wide range of applications, providing stable power for reliable performance.

Power Supplies (V): 9/16

With options for both 9V and 16V power supplies, this product offers flexibility in powering requirements for various devices.

No. of Terminals: 30

The 30 terminals allow for multiple connections and inputs, enabling complex motion control functions and customization.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink design, along with shrink pitch, improve heat dissipation and overall performance of the ICs.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures a reliable connection for long-lasting operation.

Terminal Position: DUAL

The dual terminal position enhances connectivity and simplifies installation, making this product user-friendly and efficient.

Maximum Seated Height: 2.35 mm

The low seated height allows for compact designs and space-saving solutions in applications requiring motion control ICs.

Technical Specifications

Motion Control ICs VNH2SP30TR-E attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e3

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Output Current:

30 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

9/16

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

16 mm

Trade Compliance

VNH2SP30TR-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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