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TDA1085C

Zarlink Semiconductor

TDA1085C by Zarlink Semiconductor

UNIVERSAL MOTOR CONTROLLER; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO; Package Body Material: PLASTIC/EPOXY;

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Technical Specifications

Motion Control ICs TDA1085C attributes and parameters. Explore more Motion Control ICs devices from Zarlink Semiconductor

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

15.6 V

Minimum Supply Voltage (Vsup):

15 V

Nominal Supply Voltage (Vsup):

15.3 V

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TDA1085C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-549-7536, 5962015497536

NIIN

015497536

Manufacturer Highlights

Zarlink Semiconductor

Zarlink Semiconductor - Microsemi Company Overview Zarlink Semiconductor was acquired by Microsemi as of October 2011. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Zarlink Semiconductor - Microsemi Products The types of products manufactured by Zarlink Semiconductor - Microsemi include Analog Switches, Medical Surge Protection ICs, Laser Diode Drivers (LDD), Analog Amplifiers, Telephony ICs, Packet Processing ICs, Packet Switching ICs, Timing and Synchronization (DS1/E1, SONET/SDH) ICs, TDM/TSI Switches, ATM (Asynchronous Transfer Mode) ICs, Voice Processing ICs, Optoelectronic Products, Frequency Synthesis Products, Wireless Data Products, Ultra-low Power Communication Products, Baseband Signal Processing Products, and Cellular Telephony Products.

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