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TDA1085C

Onsemi

TDA1085C by Onsemi

TDA1085C by Onsemi is a Motion Control IC with 16 terminals, operating voltage range of 15-16V. It has a max output current of 0.2A and operates b/w -10 to 120°C. Widely used as a Universal Motor Controller in various applications due to its compact size and through-hole terminal form.

Median Price

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Lifecycle Status

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Chip Stock

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Digital Electronic Gebert Verwaltungs UG

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MRC Electronics

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Nova Conductors

Japan . 100 parts In-Stock

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ECAB

Sweden . 67 parts In-Stock

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Corel Iberica Componentes, S.L.

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Fibra_Brandt Electronic GMBH

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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Semicontronic

India . 1,126 parts In-Stock

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$1.462

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$1.455

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AZTECH Wire

Italy . 445 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,700 parts In-Stock

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Continental Prestige Electronics

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SupplyDigital Components

Austria . 4,216 parts In-Stock

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Argo Parts USA

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Kulean Microsystems

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Lixinc

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Corphita

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UHIMA Technologies

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Microchip USA

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Overview

Experience the ultimate in motion control with the TDA1085C by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are both reliable and efficient. The TDA1085C is a versatile universal motor controller, perfect for a wide range of applications. With its advanced technology and precise design, this IC offers customers exceptional value, benefits, and advantages. Trust Onsemi to provide you with the best in motion control ICs for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for various applications.

Nominal Supply Voltage (Vsup): 15.3 V

The specific supply voltage ensures stable performance and compatibility with systems that require this voltage level.

No. of Terminals: 16

Having multiple terminals allows for versatile connectivity options and integration with different components in a system.

Maximum Operating Temperature: 120 °C

The high operating temperature range indicates the product's reliability and ability to perform in harsh conditions.

Width (mm): 7.62 mm

The compact width makes this product suitable for applications where space is limited or where a smaller footprint is desired.

Technology: BIPOLAR

The bipolar technology used in this product offers precise control and efficient operation, making it a reliable choice for motion control applications.

Technical Specifications

Motion Control ICs TDA1085C attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

120 Cel

Minimum Operating Temperature:

-10 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

15 V

Nominal Supply Voltage (Vsup):

15.3 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TDA1085C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-549-7536, 5962015497536

NIIN

015497536

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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