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TDA1085CD

Onsemi

TDA1085CD by Onsemi

TDA1085CD by Onsemi is a Motion Control IC with 16 terminals, operating at 15.3V supply voltage and 6mA max current. It is a Universal Motor Controller in small outline package, suitable for various motion control applications.

Median Price

$7.990

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 33 parts In-Stock

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$7.990

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33

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ComSIT Distribution GmbH

Germany . 1,516 parts In-Stock

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Digiode

USA . 739 parts In-Stock

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739

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Vyrian

USA . 389 parts In-Stock

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389

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,210 parts In-Stock

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$4.500

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Corohmni

South Africa . 193 parts In-Stock

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$7.990

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193

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AZTECH Wire

Italy . 681 parts In-Stock

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$14.952

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681

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Kepictronics

USA . 15,000 parts In-Stock

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Kulean Microsystems

USA . 5,939 parts In-Stock

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TANS Electronics

Latvia . 4,663 parts In-Stock

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Problanco Electronics

Mexico . 4,377 parts In-Stock

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Continental Prestige Electronics

USA . 3,654 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 1,804 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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Argo Parts USA

USA . 558 parts In-Stock

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558

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UHIMA Technologies

Türkiye . 61 parts In-Stock

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Overview

Unleash the power of motion control with the TDA1085CD by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are reliable and efficient. The TDA1085CD falls under the category of Motion Control ICs, making it versatile for a wide range of applications. With its compact size and advanced technology, this universal motor controller offers customers unmatched value and benefits. Experience superior performance and precision with the TDA1085CD from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY materials make the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Nominal Supply Voltage (Vsup): 15.3 V

Operates efficiently at the nominal supply voltage, ensuring stable performance.

Power Supplies (V): 15.3

Designed to handle power supplies at 15.3V, providing compatibility with standard voltage levels.

No. of Terminals: 16

Sufficient number of terminals for connecting various components, ensuring flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and facilitates compact designs in applications with size constraints.

Technology: BIPOLAR

Bipolar technology offers reliable performance and high-speed operation, essential for motion control applications.

Maximum Output Current: 0.2 A

Capable of providing a maximum output current of 0.2A, suitable for driving motors and other high-current devices.

Technical Specifications

Motion Control ICs TDA1085CD attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

15.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

15.6 V

Minimum Supply Voltage (Vsup):

15 V

Nominal Supply Voltage (Vsup):

15.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TDA1085CD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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