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TDA1185A

Onsemi

TDA1185A by Onsemi

TDA1185A by Onsemi is a Motion Control IC with 14 terminals, operating temp range of 0-70°C. It is a Universal Motor Controller with max output current of 0.002A. Ideal for applications requiring precise motor control in commercial-grade environments.

Median Price

$27.500

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 8,024 parts In-Stock

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Digiode

USA . 2,198 parts In-Stock

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Vyrian

USA . 2,129 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Vectronix, Inc

USA . 34 parts In-Stock

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J2 Sourcing AB

Sweden . 27 parts In-Stock

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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R&J Components

USA . 23 parts In-Stock

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LittleDiode

UK . 12 parts In-Stock

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Resion

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Distributors (Availability)

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Ampacity Inc.

Singapore . 373 parts In-Stock

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$4.500

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Corohmni

South Africa . 444 parts In-Stock

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Kulean Microsystems

USA . 7,304 parts In-Stock

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SupplyDigital Components

Austria . 6,311 parts In-Stock

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TANS Electronics

Latvia . 5,901 parts In-Stock

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Problanco Electronics

Mexico . 5,064 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

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Kepictronics

USA . 611 parts In-Stock

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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Overview

Unlock the power of precise motion control with the TDA1185A by Onsemi. Crafted with top-quality materials and cutting-edge technology, this universal motor controller offers unparalleled performance and reliability. Designed for a wide range of applications, this IC provides seamless integration and smooth operation. Experience the value and benefits of superior engineering with the TDA1185A, your key to optimized motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good insulation and durability, making the product reliable for long-term use.

No. of Terminals: 14

Having 14 terminals allows for more connectivity options and flexibility in the application of this motion control IC.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand heat and function efficiently even in demanding environments.

Width (mm): 7.62 mm

The compact width of 7.62 mm makes this IC suitable for applications where space is limited.

Maximum Output Current: 0.002 A

The maximum output current of 0.002 A allows for precise control and efficient power distribution in the system.

Technical Specifications

Motion Control ICs TDA1185A attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

IT OPERATES FROM A -7.6V TO -9.6V SUPPLY

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Length:

18.86 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.002 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TDA1185A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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