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DRV8244SQRYJRQ1

Texas Instruments

DRV8244SQRYJRQ1 by Texas Instruments

Texas Instruments' DRV8244SQRYJRQ1 is a Motion Control IC with 16 terminals, operating b/w -40 to 125°C. It features a max output current of 21A and supports supply voltages from 4.5V to 35V. Ideal for applications requiring a Half Bridge Brush DC Motor Controller in automotive environments (AEC-Q100).

Median Price

$6.595

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,611 parts In-Stock

1+ parts

$6.560

100+ parts

$4.240

1k+ parts

$3.980

10k+ parts

$3.740

1,611

$6.560

$4.240

$3.980

$3.740

DigiKey

USA . 3,486 parts In-Stock

1+ parts

$6.630

100+ parts

$4.287

1k+ parts

$4.143

10k+ parts

-

3,486

$6.630

$4.287

$4.143

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.072

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.072

-

-

-

Digiode

USA . 4,672 parts In-Stock

1+ parts

$5.795

100+ parts

-

1k+ parts

-

10k+ parts

-

4,672

$5.795

-

-

-

Vyrian

USA . 4,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,058

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,336 parts In-Stock

1+ parts

$2.270

100+ parts

$2.213

1k+ parts

$2.202

10k+ parts

-

4,336

$2.270

$2.213

$2.202

-

Ampacity Inc.

Singapore . 3,992 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

-

10k+ parts

-

3,992

$2.270

-

-

-

Parana Technologies

USA . 27 parts In-Stock

1+ parts

$3.018

100+ parts

-

1k+ parts

$3.528

10k+ parts

-

27

$3.018

-

$3.528

-

Argo Parts USA

USA . 3,294 parts In-Stock

1+ parts

$3.072

100+ parts

-

1k+ parts

-

10k+ parts

-

3,294

$3.072

-

-

-

Continental Prestige Electronics

USA . 1,711 parts In-Stock

1+ parts

$3.072

100+ parts

-

1k+ parts

-

10k+ parts

$3.011

1,711

$3.072

-

-

$3.011

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.072

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$3.072

-

-

-

DigiPath Technology Company

USA . 1,201 parts In-Stock

1+ parts

$3.323

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$3.323

-

-

-

ChromeModa Solutions

Germany . 3,496 parts In-Stock

1+ parts

$3.391

100+ parts

$2.781

1k+ parts

-

10k+ parts

-

3,496

$3.391

$2.781

-

-

IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$3.391

100+ parts

-

1k+ parts

$3.052

10k+ parts

-

969

$3.391

-

$3.052

-

Corphita

USA . 2,079 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$5.490

-

-

-

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$12.965

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$12.965

-

-

-

Microchip USA

USA . 4,357 parts In-Stock

1+ parts

$21.890

100+ parts

$21.750

1k+ parts

$21.680

10k+ parts

$21.620

4,357

$21.890

$21.750

$21.680

$21.620

Lixinc

USA . 19,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,182

-

-

-

-

A-Z Elektronik GmbH

Germany . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

495

-

-

-

-

Overview

Unlock precision and efficiency with the DRV8244SQRYJRQ1 by Texas Instruments, a cutting-edge motion control IC that guarantees top-notch quality and reliability. Designed for versatility and durability, this chip carrier offers seamless operation in a wide range of applications. Whether you're looking to optimize brush DC motor controllers or enhance your motion control systems, this innovative solution provides unmatched performance and value. Trust Texas Instruments to deliver industry-leading technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

The ability to be surface mounted allows for easy installation and integration into different electronic devices.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the IC meets automotive industry standards for reliability and performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making the IC ideal for compact designs.

Nominal Supply Voltage (Vsup): 13.5 V

With a nominal supply voltage of 13.5V, this IC is suitable for applications requiring higher power output.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for various control and power signals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile chip carrier style allows for space-saving and efficient thermal management.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and improves overall system functionality.

Maximum Seated Height: 1 mm

The low seated height allows for easy integration into slim and compact electronic devices.

Width (mm): 3 mm

The compact width of 3mm enables the IC to fit into tight spaces and small PCB layouts.

Other IC type: HALF BRIDGE BRUSH DC MOTOR CONTROLLER

The half-bridge brush DC motor controller design offers precise control and efficient operation of DC motors.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this IC can operate effectively in low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during the manufacturing process.

Length: 6 mm

The 6mm length provides a compact form factor for easy integration into a wide range of electronic devices.

Maximum Output Current: 21 A

The high maximum output current of 21A allows for driving high-power loads with ease.

Technology: BICMOS

The BiCMOS technology offers a unique blend of bipolar and CMOS capabilities for enhanced performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and improves overall reliability.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the IC can withstand moderate moisture exposure during storage and handling.

Maximum Supply Voltage (Vsup): 35 V

With a maximum supply voltage of 35V, this IC can handle higher voltage requirements for robust performance.

Technical Specifications

Motion Control ICs DRV8244SQRYJRQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

21 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

DRV8244SQRYJRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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