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FSB50250AS

Onsemi

FSB50250AS by Onsemi

FSB50250AS by Onsemi is a Motion Control IC with 23 terminals, operating at 15V. It features a max output current of 3.1A and supports AC motor control applications. The IC has a compact rectangular package style, making it suitable for surface mount designs in various electronic systems.

Median Price

$4.010

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 407 parts In-Stock

1+ parts

$8.740

100+ parts

$4.180

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-

10k+ parts

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407

$8.740

$4.180

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DigiKey

USA . 390 parts In-Stock

1+ parts

$8.740

100+ parts

$4.423

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-

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390

$8.740

$4.423

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Future Electronics

Canada . 10,840 parts In-Stock

1+ parts

-

100+ parts

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$2.790

10k+ parts

$2.770

10,840

-

-

$2.790

$2.770

Arrow

USA . 1,350 parts In-Stock

1+ parts

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$3.485

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1,350

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$3.485

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Chip1Stop

Japan . 900 parts In-Stock

1+ parts

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$4.010

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900

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-

$4.010

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Rochester

USA . 438 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

438

-

$3.610

$3.230

$3.040

Flip Electronics (Authorized)

USA . 404 parts In-Stock

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404

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Verical

USA . 250 parts In-Stock

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$4.513

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250

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$4.513

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,062 parts In-Stock

1+ parts

$3.819

100+ parts

-

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3,062

$3.819

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.080

100+ parts

-

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50

$5.080

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ComSIT Distribution GmbH

Germany . 19,694 parts In-Stock

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19,694

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NAC Semi

USA . 9,900 parts In-Stock

1+ parts

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$4.700

10k+ parts

$4.340

9,900

-

-

$4.700

$4.340

Vyrian

USA . 9,214 parts In-Stock

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9,214

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Chip Stock

USA . 2,636 parts In-Stock

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2,636

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IBS Electronics

USA . 1,800 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.077

10k+ parts

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1,800

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-

$5.077

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Flip Electronics

USA . 404 parts In-Stock

1+ parts

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404

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Cyclops Electronics Ltd

UK . 9 parts In-Stock

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9

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,927 parts In-Stock

1+ parts

$2.400

100+ parts

-

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8,927

$2.400

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Semicontronic

India . 8,773 parts In-Stock

1+ parts

$2.400

100+ parts

$2.340

1k+ parts

$2.328

10k+ parts

-

8,773

$2.400

$2.340

$2.328

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Corohmni

South Africa . 487 parts In-Stock

1+ parts

$2.820

100+ parts

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487

$2.820

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Corphita

USA . 875 parts In-Stock

1+ parts

$3.618

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875

$3.618

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Component Stockers USA

USA . 2,792 parts In-Stock

1+ parts

$4.890

100+ parts

$4.590

1k+ parts

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2,792

$4.890

$4.590

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Continental Prestige Electronics

USA . 686 parts In-Stock

1+ parts

$5.080

100+ parts

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$4.978

686

$5.080

-

-

$4.978

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.080

100+ parts

$4.978

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100

$5.080

$4.978

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Perfect Parts

USA . 40,635 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,063 parts In-Stock

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SupplyDigital Components

Austria . 6,448 parts In-Stock

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Microchip USA

USA . 5,864 parts In-Stock

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Argo Parts USA

USA . 2,596 parts In-Stock

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2,596

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TANS Electronics

Latvia . 2,513 parts In-Stock

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2,513

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Kulean Microsystems

USA . 1,424 parts In-Stock

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1,424

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RC Electronics

USA . 1,123 parts In-Stock

1+ parts

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100+ parts

$5.030

1k+ parts

$4.590

10k+ parts

$4.450

1,123

-

$5.030

$4.590

$4.450

Glotronic Ltd.

UK . 720 parts In-Stock

1+ parts

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720

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Supply Digital

USA . 611 parts In-Stock

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611

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UHIMA Technologies

Türkiye . 412 parts In-Stock

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412

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Problanco Electronics

Mexico . 288 parts In-Stock

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288

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Overview

Unleash the power of motion control with the FSB50250AS by Onsemi. Crafted with precision and expertise, this innovative product offers unmatched quality and reliability, setting it apart from the rest. Perfect for a wide range of applications, this Motion Control IC is designed to deliver superior performance and efficiency. Experience seamless operation and enhanced functionality while reaping the benefits of its advanced features. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations. Elevate your projects with the FSB50250AS and unlock endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging makes it easy to integrate this motion control IC into compact electronic designs.

Nominal Supply Voltage (Vsup): 15 V

With a nominal supply voltage of 15V, this IC is suitable for a wide range of applications that require this voltage level.

No. of Terminals: 23

The 23 terminals provide multiple connection points for interfacing with other components, offering versatility in design.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly packaging ensures high reliability and precision in the performance of this IC.

Maximum Output Current: 3.1 A

The high maximum output current of 3.1A allows for driving various types of motors and handling different load requirements.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC has good resistance to moisture, ensuring its reliability in different environmental conditions.

Maximum Supply Voltage (Vsup): 16.5 V

The maximum supply voltage of 16.5V provides a safety margin and flexibility in operation, protecting the IC from overvoltage conditions.

Technical Specifications

Motion Control ICs FSB50250AS attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-G23

JESD-609 Code:

e3

Length:

29 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

23

Maximum Output Current:

3.1 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE,23LEAD,0.7

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

.2 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

FSB50250AS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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