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IRMCK311TY

Infineon Technologies

IRMCK311TY by Infineon Technologies

The Infineon IRMCK311TY is a Motion Control IC with 64 terminals in a square flatpack package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies of 1.8V and 3.3V, it utilizes CMOS technology for precise motion control systems.

Median Price

$4.815

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,649 parts In-Stock

1+ parts

-

100+ parts

$4.280

1k+ parts

$3.830

10k+ parts

$3.600

28,649

-

$4.280

$3.830

$3.600

Verical

USA . 20,816 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

$4.787

10k+ parts

$4.500

20,816

-

$5.350

$4.787

$4.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 706 parts In-Stock

1+ parts

$4.512

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$4.512

-

-

-

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$4.549

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$4.549

-

-

-

Vyrian

USA . 30,207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,207

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 29,973 parts In-Stock

1+ parts

$4.040

100+ parts

-

1k+ parts

-

10k+ parts

-

29,973

$4.040

-

-

-

Corphita

USA . 944 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

-

944

$4.275

-

-

-

Continental Prestige Electronics

USA . 4,517 parts In-Stock

1+ parts

$4.549

100+ parts

-

1k+ parts

-

10k+ parts

$4.458

4,517

$4.549

-

-

$4.458

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.549

100+ parts

$4.458

1k+ parts

-

10k+ parts

-

100

$4.549

$4.458

-

-

Component Stockers USA

USA . 4,980 parts In-Stock

1+ parts

$4.820

100+ parts

$4.530

1k+ parts

$4.100

10k+ parts

$4.100

4,980

$4.820

$4.530

$4.100

$4.100

Aztec Data Supply Inc.

USA . 97 parts In-Stock

1+ parts

$10.363

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$10.363

-

-

-

Modulus Dynamics

Lithuania . 1,621 parts In-Stock

1+ parts

$11.144

100+ parts

$10.698

1k+ parts

$10.252

10k+ parts

-

1,621

$11.144

$10.698

$10.252

-

Corohmni

South Africa . 132 parts In-Stock

1+ parts

$23.450

100+ parts

-

1k+ parts

-

10k+ parts

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132

$23.450

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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21,252

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Argo Parts USA

USA . 4,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,866

-

-

-

-

Microchip USA

USA . 3,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,798

-

-

-

-

Overview

Upgrade your motion control systems with the IRMCK311TY by Infineon Technologies. Designed with quality and precision in mind, this motion control IC boasts a range of applications in various industries. Infineon Technologies is a trusted manufacturer known for delivering top-notch products, and this one is no exception. With its high performance capabilities and reliable operation, this product offers unparalleled value to customers. Experience smoother and more efficient motion control with the IRMCK311TY.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and interfaces for various external devices, increasing versatility.

Package Style (Meter): FLATPACK

Flatpack package style is compact and space-efficient, making it ideal for applications with limited board space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality or reliability.

Terminal Position: QUAD

Quad terminal position provides better stability and connectivity for the IC, reducing the risk of signal interference or loss.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures consistent performance and reliability in harsh operating conditions typical of industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and easy PCB mounting, enhancing the overall robustness and durability of the product.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for a higher density of connections in a limited space, enabling more functionality and features in a compact form factor.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the IC is moderately sensitive to moisture exposure, prompting proper handling and storage to prevent damage during manufacturing and assembly processes.

Technical Specifications

Motion Control ICs IRMCK311TY attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQFP-G64

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

IRMCK311TY Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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