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LA6584M-TLM-H

Onsemi

LA6584M-TLM-H by Onsemi

LA6584M-TLM-H by Onsemi is a motion control IC with 16 terminals, operating voltage of 2.8-12V, and max output current of 1.6A. Ideal for brushless DC motor control applications due to its small outline package and temp range of -30 to 90°C.

Median Price

$1.152

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,938 parts In-Stock

1+ parts

$1.940

100+ parts

$1.401

1k+ parts

$0.954

10k+ parts

-

1,938

$1.940

$1.401

$0.954

-

Rochester

USA . 105,990 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$0.921

10k+ parts

$0.821

105,990

-

$1.110

$0.921

$0.821

Verical

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.152

10k+ parts

$1.027

58,000

-

-

$1.152

$1.027

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,146 parts In-Stock

1+ parts

$0.902

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

$0.902

-

-

-

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

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64

$0.944

-

-

-

Vyrian

USA . 74,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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74,921

-

-

-

-

Chip Stock

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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58,000

-

-

-

-

Cyclops Electronics Ltd

UK . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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28,000

-

-

-

-

Bristol Electronics

USA . 1,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,996

-

-

-

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Dan-Mar Components

USA . 1,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,996

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 74,542 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

74,542

$0.810

-

-

-

Semicontronic

India . 74,540 parts In-Stock

1+ parts

$0.810

100+ parts

$0.790

1k+ parts

$0.786

10k+ parts

-

74,540

$0.810

$0.790

$0.786

-

Corphita

USA . 373 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$0.855

-

-

-

Corohmni

South Africa . 256 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$0.907

-

-

-

Argo Parts USA

USA . 4,927 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

-

4,927

$0.944

-

-

-

Component Stockers USA

USA . 100,304 parts In-Stock

1+ parts

$0.970

100+ parts

$0.910

1k+ parts

$0.830

10k+ parts

$0.830

100,304

$0.970

$0.910

$0.830

$0.830

Aztec Data Supply Inc.

USA . 492 parts In-Stock

1+ parts

$12.220

100+ parts

-

1k+ parts

-

10k+ parts

-

492

$12.220

-

-

-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$21.133

100+ parts

$20.076

1k+ parts

$20.076

10k+ parts

-

300

$21.133

$20.076

$20.076

-

Continental Prestige Electronics

USA . 105,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.687

10k+ parts

-

105,990

-

-

$0.687

-

Metaverse IC Inc.

Canada . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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28,000

-

-

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Assy Fe

Spain . 28,000 parts In-Stock

1+ parts

-

100+ parts

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28,000

-

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QUARKTWIN TECHNOLOGY LTD

USA . 17,135 parts In-Stock

1+ parts

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17,135

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Kepictronics

USA . 15,996 parts In-Stock

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15,996

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TANS Electronics

Latvia . 6,621 parts In-Stock

1+ parts

-

100+ parts

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6,621

-

-

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SupplyDigital Components

Austria . 5,864 parts In-Stock

1+ parts

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5,864

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Problanco Electronics

Mexico . 4,344 parts In-Stock

1+ parts

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4,344

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Kulean Microsystems

USA . 2,634 parts In-Stock

1+ parts

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2,634

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.925

1k+ parts

$0.897

10k+ parts

$0.878

1,000

-

$0.925

$0.897

$0.878

UHIMA Technologies

Türkiye . 443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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443

-

-

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Microchip USA

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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160

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-

-

-

Overview

Elevate your motion control systems with the LA6584M-TLM-H by Onsemi. Crafted with precision and expertise, this small outline, low profile IC offers unparalleled performance in a wide range of applications. From brushless DC motor control to intricate electronic systems, this versatile component ensures smooth operation and efficient power management. Trust in Onsemi's reputation for quality and innovation, and experience the seamless integration and reliability that the LA6584M-TLM-H brings to your projects. Unlock the potential of your designs with this superior motion control IC today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various operating environments.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, making it ideal for space-constrained applications.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage ensures compatibility with standard power sources, making integration straightforward.

Power Supplies (V): 12

With 12 power supplies available, this IC offers versatility in powering different components within a system.

No. of Terminals: 16

The 16 terminals provide ample connection points for interfacing with other devices, enhancing the IC's functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style offers a combination of compact size and low profile, making it suitable for space-sensitive applications.

Maximum Operating Temperature: 90 °C

The high operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -30 °C

The low operating temperature ensures the IC can function efficiently even in cold environments.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides a reliable and corrosion-resistant connection, prolonging the IC's lifespan.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting and installation options, catering to different design requirements.

Maximum Seated Height: 1.7 mm

The low seated height allows for a compact overall system design, saving space and enhancing integration possibilities.

Width (mm): 5.4 mm

The narrow width of 5.4mm enables the IC to fit into tight spaces, making it suitable for applications with limited room.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Being a brushless DC motor controller, this IC is specifically designed for precise and efficient motor control applications.

Minimum Supply Voltage (Vsup): 2.8 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the IC versatile and adaptable.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand peak reflow temperature for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C makes the IC suitable for lead-free soldering processes, ensuring reliability in manufacturing.

Length: 12.5 mm

The 12.5mm length provides a compact form factor, making the IC suitable for applications with limited space availability.

Maximum Supply Current (Isup): 9 mA

The low maximum supply current requirement of 9mA results in efficient power consumption, enhancing energy efficiency.

Maximum Output Current: 1.6 A

With a maximum output current of 1.6A, this IC can drive demanding loads, making it suitable for high-power applications.

Technology: BIPOLAR

This bipolar technology ensures reliable performance and precise control, making the IC a dependable choice for motion control applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and secure connections, ensuring robust electrical connections.

Terminal Pitch: 1 mm

The 1mm terminal pitch enables precise and compact layout designs, optimizing PCB space usage.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the IC's sensitivity to moisture, allowing for proper handling and storage to maintain functionality.

Maximum Supply Voltage (Vsup): 14 V

The high maximum supply voltage tolerance of 14V provides a safety margin for voltage spikes, ensuring the IC's robustness in varying conditions.

Technical Specifications

Motion Control ICs LA6584M-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16/24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.4 mm

Trade Compliance

LA6584M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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