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LA6583MC-AH

Onsemi

LA6583MC-AH by Onsemi

LA6583MC-AH by Onsemi is a Motion Control IC with 12V supply, suitable for Brushless DC Motor Controllers. Features include 10 terminals, 0.8A output current, and operating temperatures from -30 to 100 °C. Ideal for applications requiring precise motion control in compact spaces.

Median Price

$0.587

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 190 parts In-Stock

1+ parts

$1.180

100+ parts

$0.628

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190

$1.180

$0.628

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Rochester

USA . 4,085 parts In-Stock

1+ parts

-

100+ parts

$0.587

1k+ parts

$0.487

10k+ parts

$0.434

4,085

-

$0.587

$0.487

$0.434

Farnell

UK . 190 parts In-Stock

1+ parts

-

100+ parts

$0.513

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10k+ parts

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190

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$0.513

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Distributors (In-Stock)

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Digiode

USA . 1,643 parts In-Stock

1+ parts

$0.457

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1,643

$0.457

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Flip Electronics

USA . 126,000 parts In-Stock

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Vyrian

USA . 5,052 parts In-Stock

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5,052

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ACDS - Activité Composants Distribution Service

France . 965 parts In-Stock

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965

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Bristol Electronics

USA . 965 parts In-Stock

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965

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Dan-Mar Components

USA . 965 parts In-Stock

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965

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Distributors (Availability)

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Continental Prestige Electronics

USA . 190 parts In-Stock

1+ parts

$0.284

100+ parts

-

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190

$0.284

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Corohmni

South Africa . 487 parts In-Stock

1+ parts

$0.329

100+ parts

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487

$0.329

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Corphita

USA . 565 parts In-Stock

1+ parts

$0.433

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565

$0.433

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AZTECH Wire

Italy . 1,109 parts In-Stock

1+ parts

$17.020

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1,109

$17.020

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RC Electronics

USA . 51,889 parts In-Stock

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51,889

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Problanco Electronics

Mexico . 6,962 parts In-Stock

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Kulean Microsystems

USA . 5,934 parts In-Stock

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5,934

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TANS Electronics

Latvia . 4,612 parts In-Stock

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4,612

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Kepictronics

USA . 690 parts In-Stock

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690

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UHIMA Technologies

Türkiye . 647 parts In-Stock

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647

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SupplyDigital Components

Austria . 374 parts In-Stock

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374

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Microchip USA

USA . 290 parts In-Stock

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290

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Overview

Discover the LA6583MC-AH by Onsemi, a high-quality Motion Control IC designed to revolutionize your electronic projects. With its advanced technology and reliable performance, this product offers unparalleled value and benefits to customers. Whether you're working on robotics, automation, or motor control applications, this Brushless DC Motor Controller is the perfect solution for your needs. Trust in Onsemi's expertise and elevate your projects to new heights with the LA6583MC-AH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the product resistant to damage and suitable for various applications.

Surface Mount: YES

Facilitates easy installation and PCB assembly, saving time and effort during product integration.

Nominal Supply Voltage (Vsup): 12 V

Suitable operating voltage for efficient performance and compatibility with common power sources.

Power Supplies (V): 12

Matches the nominal supply voltage, ensuring consistent and reliable power delivery to the IC.

Maximum Operating Temperature: 100 °C

Allows for reliable operation in a wide range of environmental conditions, ensuring stability and longevity.

Minimum Operating Temperature: -30 °C

Enables the IC to function in cold temperatures without performance degradation, expanding its usability.

Maximum Seated Height: 1.55 mm

Compact size for space-constrained applications, offering flexibility in design and integration.

Minimum Supply Voltage (Vsup): 2.8 V

Supports low power operation and efficiency, making the product suitable for energy-conscious applications.

Maximum Output Current: 0.8 A

Provides sufficient current for driving motors and handling load requirements, ensuring smooth operation.

Technical Specifications

Motion Control ICs LA6583MC-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.55 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LA6583MC-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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