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LA6581MC

Onsemi

LA6581MC by Onsemi

LA6581MC by Onsemi is a Motion Control IC with 8 terminals, operating voltage range of 2.2V to 16V, and max output current of 0.5A. Ideal for Brushless DC motor control applications due to its compact size (4.9mm x 3.9mm) and temp range (-30 °C to 100°C).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,201 parts In-Stock

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Digiode

USA . 121 parts In-Stock

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121

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SupplyDigital Components

Austria . 7,151 parts In-Stock

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Problanco Electronics

Mexico . 6,364 parts In-Stock

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TANS Electronics

Latvia . 5,610 parts In-Stock

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Kulean Microsystems

USA . 4,055 parts In-Stock

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Corphita

USA . 1,552 parts In-Stock

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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Corohmni

South Africa . 315 parts In-Stock

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Overview

Experience unparalleled precision and efficiency with the LA6581MC Motion Control IC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This product is perfect for various applications in the motion control category, offering customers exceptional value and benefits. Enhance your projects with seamless performance and maximize productivity with the LA6581MC. Power up your creations with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, making it easy to integrate into various applications.

Surface Mount: YES

Easily mountable on printed circuit boards, enabling efficient assembly and space-saving designs.

Nominal Supply Voltage (Vsup): 12 V

Suitable for a wide range of voltage requirements, making it versatile for different system configurations.

Maximum Operating Temperature: 100 °C

Can operate in high-temperature environments, ensuring reliability in demanding conditions.

Minimum Operating Temperature: -30 °C

Capable of functioning in low-temperature environments, making it suitable for a variety of applications.

Maximum Output Current: 0.5 A

Can deliver a moderate amount of current, suitable for driving brushless DC motors efficiently.

Technical Specifications

Motion Control ICs LA6581MC attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LA6581MC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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