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LA6583MC

Onsemi

LA6583MC by Onsemi

LA6583MC by Onsemi is a Motion Control IC with 10 terminals, operating voltage range of 2.8V to 14V, and max output current of 0.8A. Ideal for Brushless DC motor control applications due to its compact size (5mm x 4.4mm) and temp range (-30 °C to 100°C). Surface mountable in plastic/epoxy package for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,953 parts In-Stock

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Digiode

USA . 1,401 parts In-Stock

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TANS Electronics

Latvia . 7,969 parts In-Stock

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Problanco Electronics

Mexico . 4,944 parts In-Stock

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SupplyDigital Components

Austria . 3,150 parts In-Stock

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Corphita

USA . 447 parts In-Stock

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Kulean Microsystems

USA . 373 parts In-Stock

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Corohmni

South Africa . 258 parts In-Stock

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UHIMA Technologies

Türkiye . 86 parts In-Stock

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Overview

Unlock the power of precision and efficiency with the LA6583MC by Onsemi. As a leading manufacturer in motion control ICs, Onsemi delivers top-quality products that guarantee optimal performance and reliability. Designed for brushless DC motor controllers, this small outline, low profile IC offers seamless integration and superior functionality. With a nominal supply voltage of 12V and a maximum output current of 0.8A, the LA6583MC is the perfect solution for a wide range of applications, ensuring smooth operation and enhanced productivity. Elevate your projects with the unmatched value and benefits of the LA6583MC from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Motion Control IC, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the Motion Control IC onto a PCB, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 12 V

The 12 V nominal supply voltage ensures compatibility with a wide range of systems and applications, making this Motion Control IC versatile and easy to integrate.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this Motion Control IC can withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Maximum Output Current: 0.8 A

The maximum output current of 0.8 A allows the Motion Control IC to effectively drive and control motors with higher power requirements, offering reliable performance in various motion control applications.

Technical Specifications

Motion Control ICs LA6583MC attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

SEATED HGT-NOM

JESD-30 Code:

R-PDSO-G10

Length:

5 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.55 mm

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LA6583MC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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