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LA6581T

Onsemi

LA6581T by Onsemi

LA6581T by Onsemi is a Motion Control IC with 8 terminals, operating voltage of 2.5-16V, and max output current of 0.3A. Ideal for brushless DC motor control applications due to its small outline package and bipolar technology. Operating temperature range from -20 to 90 °C makes it versatile for various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,571 parts In-Stock

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Vyrian

USA . 950 parts In-Stock

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950

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TANS Electronics

Latvia . 8,058 parts In-Stock

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SupplyDigital Components

Austria . 6,567 parts In-Stock

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Problanco Electronics

Mexico . 6,470 parts In-Stock

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Kulean Microsystems

USA . 5,900 parts In-Stock

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Corphita

USA . 1,892 parts In-Stock

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UHIMA Technologies

Türkiye . 834 parts In-Stock

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834

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Corohmni

South Africa . 418 parts In-Stock

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Overview

Enhance your motion control applications with the LA6581T by Onsemi. Crafted with precision and quality, this brushless DC motor controller offers unparalleled performance and reliability. With a compact design and advanced technology, this IC provides seamless integration and efficient operation for various systems. Trust in Onsemi's expertise in motion control ICs to elevate your projects to new heights. Experience the value and benefits of the LA6581T today for a smoother and more precise motion control experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, suitable for various applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and enabling automation in assembly.

Nominal Supply Voltage (Vsup): 12 V

Efficiently operates at a common supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 90 °C

Ensures reliable performance even in high-temperature environments, increasing the longevity of the product.

Minimum Operating Temperature: -20 °C

Can withstand low temperatures, suitable for use in various climates and conditions.

Maximum Seated Height: 1.1 mm

Low-profile design allows for compact integration in space-constrained applications.

Technology: BIPOLAR

Utilizes bipolar technology for precise control and efficient operation of the brushless DC motor.

Technical Specifications

Motion Control ICs LA6581T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

19 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

LA6581T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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