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LA6565

Onsemi

LA6565 by Onsemi

LA6565 by Onsemi is a Motion Control IC with 36 terminals, operating at -40 to 85 °C. It features a max output current of 1A, suitable for BRUSH DC MOTOR CONTROL applications. The IC has a small outline package style and can operate within an industrial temperature grade range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 736 parts In-Stock

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736

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Vyrian

USA . 87 parts In-Stock

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87

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,604 parts In-Stock

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7,604

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Problanco Electronics

Mexico . 5,326 parts In-Stock

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5,326

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Kulean Microsystems

USA . 2,849 parts In-Stock

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2,849

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Corphita

USA . 2,150 parts In-Stock

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2,150

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UHIMA Technologies

Türkiye . 387 parts In-Stock

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387

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TANS Electronics

Latvia . 195 parts In-Stock

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Corohmni

South Africa . 128 parts In-Stock

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128

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Overview

Elevate your motion control applications with the LA6565 by Onsemi. This high-quality brush DC motor controller offers unmatched precision and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. Whether you're designing robotics, automation systems, or consumer electronics, this compact IC provides the power and efficiency you need to bring your projects to life. Say goodbye to performance limitations and hello to endless possibilities with the LA6565.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to external elements, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, reducing assembly time and effort.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures reliable operation even in extreme cold environments.

Maximum Output Current: 1 A

The high maximum output current allows for efficient control of brush DC motors, making it suitable for various motion control applications.

Technical Specifications

Motion Control ICs LA6565 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

Length:

17.8 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

7.9 mm

Trade Compliance

LA6565 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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